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Grain refinement of micrometer-scale Cu foils through accumulative cyclic deformation
Liang,F1,2; Dai,C Y1,3; Zhang,G P2
2018-06-13
Source PublicationMaterials Research Express
ISSN2053-1591
Volume5Issue:6
AbstractAbstract The microstructure evolution of the 190 μm-thick Cu foils subjected to repeatedly bending loading was investigated. We found that the grains in the micron-scale foil were refined into subgrains with a size of about 0.5 μm through a removal of twin boundaries and an introduction of a high frequency of high angle boundaries (>15°) with accumulative cyclic deformation. With increasing strain rate (loading frequency), the grains are completely refined into well-defined fine grains with high angle boundaries. Such the microstructure refinement induced by accumulative cyclic deformation may provide a potential strategy for grain refinement of small-scale materials.
Keywordgrain refinement cyclic loading strain rate Cu foil micron scale
DOI10.1088/2053-1591/aac93b
Language英语
WOS IDIOP:2053-1591-5-6-aac93b
PublisherIOP Publishing
Citation statistics
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/80520
Affiliation1.Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, 72 Wenhua Road, Shenyang 110016, People’s Republic of China
2.School of Materials Science and Engineering, University of Science and Technology of China, Shenyang 110016, People’s Republic of China
3.School of Material Science/Engineering, Shenyang University of Chemical Technology, Shenyang 110142, People’s Republic of China
Recommended Citation
GB/T 7714
Liang,F,Dai,C Y,Zhang,G P. Grain refinement of micrometer-scale Cu foils through accumulative cyclic deformation[J]. Materials Research Express,2018,5(6).
APA Liang,F,Dai,C Y,&Zhang,G P.(2018).Grain refinement of micrometer-scale Cu foils through accumulative cyclic deformation.Materials Research Express,5(6).
MLA Liang,F,et al."Grain refinement of micrometer-scale Cu foils through accumulative cyclic deformation".Materials Research Express 5.6(2018).
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