IMR OpenIR
Reliability issues of lead-free solder joints in electronic devices
Jiang, Nan; Zhang, Liang; Liu, Zhi-Quan; Sun, Lei; Long, Wei-Min; He, Peng; Xiong, Ming-Yue; Zhao, Meng
2019-12-31
Source PublicationSCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS
ISSN1468-6996
Volume20Issue:1Pages:876-901
AbstractElectronic products are evolving towards miniaturization, high integration, and multi-function, which undoubtedly puts forward higher requirements for the reliability of solder joints in electronic packaging. Approximately 70% of failure in electronic devices originates during the packaging process, mostly due to the failure of solder joints. With the improvement of environmental protection awareness, lead-free solder joints have become a hot issue in recent years. This paper reviews the research progress on the reliability of lead-free solder joints and discusses the influence of temperature, vibration, tin whisker and electromigration on the reliability of solder joints. In addition, the measures to improve the reliability of solder joints are analyzed according to the problems of solder joints themselves, which provides a further theoretical basis for the study of the reliability of solder joints of electronic products in service.
KeywordLead-free solder reliability IMC crack failure
Indexed BySCI
Language英语
WOS IDWOS:000483617100001
PublisherTAYLOR & FRANCIS LTD
Citation statistics
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/80550
Collection中国科学院金属研究所
Affiliation1.作者单位列格式:
2.中国科学院大学;
3.中国科学院兰州文献情报中心
Recommended Citation
GB/T 7714
Jiang, Nan,Zhang, Liang,Liu, Zhi-Quan,et al. Reliability issues of lead-free solder joints in electronic devices[J]. SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS,2019,20(1):876-901.
APA Jiang, Nan.,Zhang, Liang.,Liu, Zhi-Quan.,Sun, Lei.,Long, Wei-Min.,...&Zhao, Meng.(2019).Reliability issues of lead-free solder joints in electronic devices.SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS,20(1),876-901.
MLA Jiang, Nan,et al."Reliability issues of lead-free solder joints in electronic devices".SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS 20.1(2019):876-901.
Files in This Item:
There are no files associated with this item.
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[Jiang, Nan]'s Articles
[Zhang, Liang]'s Articles
[Liu, Zhi-Quan]'s Articles
Baidu academic
Similar articles in Baidu academic
[Jiang, Nan]'s Articles
[Zhang, Liang]'s Articles
[Liu, Zhi-Quan]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[Jiang, Nan]'s Articles
[Zhang, Liang]'s Articles
[Liu, Zhi-Quan]'s Articles
Terms of Use
No data!
Social Bookmark/Share
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.