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Structure and properties of Sn-Cu lead-free solders in electronics packaging
Zhao, Meng; Zhang, Liang; Liu, Zhi-Quan; Xiong, Ming-Yue; Sun, Lei
2019-12-31
Source PublicationSCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS
ISSN1468-6996
Volume20Issue:1Pages:421-444
AbstractWith the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder has attracted wide attention due to its excellent comprehensive performance and low cost. In this article, we present recent developments in Sn-Cu lead-free solder alloys. From the microstructure and interfacial structure, the evolution law of the internal structure of solder alloy/solder joint was analysed, and the model and theory describing the formation/growth mechanism of interfacial IMC were introduced. In addition, the effects of alloying, particle strengthening and process methods on the properties of Sn-Cu lead-free solders, including wettability, melting and mechanical properties, were described. Finally, we outline the issues that need to be resolved in the future research. [GRAPHICS] .
KeywordSn-Cu microstructures IMC mechanical properties
Indexed BySCI
Language英语
WOS IDWOS:000467812600001
PublisherTAYLOR & FRANCIS LTD
Citation statistics
Cited Times:9[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/80551
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
Zhao, Meng,Zhang, Liang,Liu, Zhi-Quan,et al. Structure and properties of Sn-Cu lead-free solders in electronics packaging[J]. SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS,2019,20(1):421-444.
APA Zhao, Meng,Zhang, Liang,Liu, Zhi-Quan,Xiong, Ming-Yue,&Sun, Lei.(2019).Structure and properties of Sn-Cu lead-free solders in electronics packaging.SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS,20(1),421-444.
MLA Zhao, Meng,et al."Structure and properties of Sn-Cu lead-free solders in electronics packaging".SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS 20.1(2019):421-444.
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