IMR OpenIR
Anand constitutive model of lead-free solder joints in 3D IC device
Zhang,Liang1,2; Liu,Zhi-quan2; Ji,Yu-tong3
2016-08-01
Source PublicationJournal of Physics: Conference Series
ISSN1742-6588
Volume738Issue:1
AbstractAbstract Anand constitutive relation of SnAgCu and SnAgCu-nano Al solders were studied under uniaxial tension, and the constitutive model was used in the finite element simulation to analyze the stress-strain response of lead-free solder joints in 3D IC devices. The results showed that the nine parameters of the Anand model can be determined from separated constitutive relations and experimental results. Based on Anand model, the finite element method was selected to calculate the stress-strain response of lead-free solder joints, it was found that in the 3D IC device the maximum stress-strain concentrated in the concern solder joints, the stress-strain of SnAgCu-nano Al solder joints was lower than that of SnAgCu solder joints, which represented that the addition of nano Al particles can enhance the reliability of lead-free solder joints in 3D IC devices.
DOI10.1088/1742-6596/738/1/012050
Language英语
WOS IDIOP:1742-6588-738-1-012050
PublisherIOP Publishing
Citation statistics
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/80579
Affiliation1.School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, China
2.Institute of Metal Research, Chinese Academy of Sciences, Shenyang110016, China
3.School of Information and Art, Jiangsu Vocational Institute of Architectural Technology, Xuzhou 221116, China
Recommended Citation
GB/T 7714
Zhang,Liang,Liu,Zhi-quan,Ji,Yu-tong. Anand constitutive model of lead-free solder joints in 3D IC device[J]. Journal of Physics: Conference Series,2016,738(1).
APA Zhang,Liang,Liu,Zhi-quan,&Ji,Yu-tong.(2016).Anand constitutive model of lead-free solder joints in 3D IC device.Journal of Physics: Conference Series,738(1).
MLA Zhang,Liang,et al."Anand constitutive model of lead-free solder joints in 3D IC device".Journal of Physics: Conference Series 738.1(2016).
Files in This Item:
There are no files associated with this item.
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[Zhang,Liang]'s Articles
[Liu,Zhi-quan]'s Articles
[Ji,Yu-tong]'s Articles
Baidu academic
Similar articles in Baidu academic
[Zhang,Liang]'s Articles
[Liu,Zhi-quan]'s Articles
[Ji,Yu-tong]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[Zhang,Liang]'s Articles
[Liu,Zhi-quan]'s Articles
[Ji,Yu-tong]'s Articles
Terms of Use
No data!
Social Bookmark/Share
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.