IMR OpenIR
Electrical/thermal behaviors of bimetallic (Ag–Cu, Ag–Sn) nanoparticles for printed electronics
Wang,Xin1; Huang,Feirong1; Wang,Dongxing2; Li,Da3; Li,Pu4; Muhammad,Javid1; Dong,Xinglong1; Zhang,Zhidong3
2020-01-14
Source PublicationNanotechnology
ISSN0957-4484
Volume31Issue:13
AbstractAbstract In this work, Ag–Cu and Ag–Sn nanoparticles (NPs) were synthesized by a physical vapor condensation method, i.e. DC arc-discharge plasma. The as-prepared bimetallic NPs consist of metallic cores of Ag–Cu or Ag–Sn and ultrathin oxide shells of CuO or a hybrid of SnO and SnO2. Ag–Sn NPs exhibit a room-temperature resistivity of 4.24?×?10?5 Ω?·?cm, a little lower than 7.10?×?10?5 Ω?·?cm of Ag–Cu NPs. Both bimetallic NPs demonstrate typical metallic conduction behavior with a positive temperature coefficient of resistance over 25–300 K. Ag–Sn NPs exhibit thermally competitive stability up to 230 °C and a lower resistivity of 3.18?×?10?5 Ω?·?cm after sintering at 200 °C, giving it potential for application in flexible printed electronics.
KeywordDC arc-discharge method bimetallic nanoparticles printed electronics thermal stability resistivity
DOI10.1088/1361-6528/ab5fed
Language英语
WOS IDIOP:0957-4484-31-13-ab5fed
PublisherIOP Publishing
Citation statistics
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/80610
Affiliation1.School of Materials Science and Engineering, Key Laboratory of Materials Modification by Laser, Ion and Electron Beams (Ministry of Education), Dalian University of Technology, Dalian 116023, People’s Republic of China
2.Institute of Materials, Ningbo University of Technology, Ningbo, 315016, People’s Republic of China
3.Shenyang National Laboratory for Materials Science, Institute of Metal Research, International Centre for Materials Physics, Chinese Academy of Sciences, Shenyang 110016, People’s Republic of China
4.China United Test & Certification Co., LTD, General Research Institute for Nonferrous Metals, Beijing, 100088, People’s Republic of China
Recommended Citation
GB/T 7714
Wang,Xin,Huang,Feirong,Wang,Dongxing,等. Electrical/thermal behaviors of bimetallic (Ag–Cu, Ag–Sn) nanoparticles for printed electronics[J]. Nanotechnology,2020,31(13).
APA Wang,Xin.,Huang,Feirong.,Wang,Dongxing.,Li,Da.,Li,Pu.,...&Zhang,Zhidong.(2020).Electrical/thermal behaviors of bimetallic (Ag–Cu, Ag–Sn) nanoparticles for printed electronics.Nanotechnology,31(13).
MLA Wang,Xin,et al."Electrical/thermal behaviors of bimetallic (Ag–Cu, Ag–Sn) nanoparticles for printed electronics".Nanotechnology 31.13(2020).
Files in This Item:
There are no files associated with this item.
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[Wang,Xin]'s Articles
[Huang,Feirong]'s Articles
[Wang,Dongxing]'s Articles
Baidu academic
Similar articles in Baidu academic
[Wang,Xin]'s Articles
[Huang,Feirong]'s Articles
[Wang,Dongxing]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[Wang,Xin]'s Articles
[Huang,Feirong]'s Articles
[Wang,Dongxing]'s Articles
Terms of Use
No data!
Social Bookmark/Share
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.