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Grain refinement of micrometer-scale Cu foils through accumulative cyclic deformation
Liang,F1,2; Dai,C Y1,3; Zhang,G P2
2018-06-13
发表期刊Materials Research Express
ISSN2053-1591
卷号5期号:6
摘要Abstract The microstructure evolution of the 190 μm-thick Cu foils subjected to repeatedly bending loading was investigated. We found that the grains in the micron-scale foil were refined into subgrains with a size of about 0.5 μm through a removal of twin boundaries and an introduction of a high frequency of high angle boundaries (>15°) with accumulative cyclic deformation. With increasing strain rate (loading frequency), the grains are completely refined into well-defined fine grains with high angle boundaries. Such the microstructure refinement induced by accumulative cyclic deformation may provide a potential strategy for grain refinement of small-scale materials.
关键词grain refinement cyclic loading strain rate Cu foil micron scale
DOI10.1088/2053-1591/aac93b
语种英语
WOS记录号IOP:2053-1591-5-6-aac93b
出版者IOP Publishing
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文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/80639
作者单位1.Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, 72 Wenhua Road, Shenyang 110016, People’s Republic of China
2.School of Materials Science and Engineering, University of Science and Technology of China, Shenyang 110016, People’s Republic of China
3.School of Material Science/Engineering, Shenyang University of Chemical Technology, Shenyang 110142, People’s Republic of China
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Liang,F,Dai,C Y,Zhang,G P. Grain refinement of micrometer-scale Cu foils through accumulative cyclic deformation[J]. Materials Research Express,2018,5(6).
APA Liang,F,Dai,C Y,&Zhang,G P.(2018).Grain refinement of micrometer-scale Cu foils through accumulative cyclic deformation.Materials Research Express,5(6).
MLA Liang,F,et al."Grain refinement of micrometer-scale Cu foils through accumulative cyclic deformation".Materials Research Express 5.6(2018).
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