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Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method
Jiang, Lin; Zhang, Liang; Liu, Zhi-Quan
2019-11-01
Source PublicationACTA METALLURGICA SINICA-ENGLISH LETTERS
ISSN1006-7191
Volume32Issue:11Pages:1407-1414
AbstractTarget assembly is a key consumable material for producing thin film used in the electronic packaging and devices. The residual stresses induced during the process of soldering are detrimental to the performance of target assembly. In this work, the intensity and distribution of the soldering residual stress of Co/In/Cu target assembly subjected to a 20 W/(m(2) K) cooling condition corresponding to the actual air cooling process were studied, based on finite element simulation and Taguchi method, to optimize the sputtering target assembly. Effects of different control factors, including solder material, thickness of solder layer, target and backing plate, on the soldering residual stress of target assembly are investigated. The maximum residual stress is calculated as 9.28 MPa in the target located at 0.16 mm from target-solder layer interface and at a distance of 0.78 mm from symmetry axis. The optimal design in target assembly has the combination of indium solder material, cobalt target at 12 mm thick, solder layer at 0.8 mm thick, copper backing plate at 15 mm thick. Moreover, solder material is the most important factor among control factors in the target assembly.
KeywordCo target assembly Solder Residual stress Simulation Taguchi method Optimal design
Indexed BySCI
Language英语
WOS IDWOS:000488930700011
PublisherCHINESE ACAD SCIENCES, INST METAL RESEARCH
Citation statistics
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/80675
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
Jiang, Lin,Zhang, Liang,Liu, Zhi-Quan. Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method[J]. ACTA METALLURGICA SINICA-ENGLISH LETTERS,2019,32(11):1407-1414.
APA Jiang, Lin,Zhang, Liang,&Liu, Zhi-Quan.(2019).Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method.ACTA METALLURGICA SINICA-ENGLISH LETTERS,32(11),1407-1414.
MLA Jiang, Lin,et al."Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method".ACTA METALLURGICA SINICA-ENGLISH LETTERS 32.11(2019):1407-1414.
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