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Electrochemical behavior of Ti-Ni shape memory alloy in fibrinogen solution
Liang, CH; Guo, HX; Chen, BY
通讯作者Liang, CH(liangch@chem.dlut.edu.cn)
2004-02-01
发表期刊TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA
ISSN1003-6326
卷号14期号:1页码:33-36
摘要Electrochemical behaviors of Ti-Ni shape memory alloy in fibrinogen solution were studied by electrochemical techniques. The results indicate that the addition of the fibrinogen has no obvious effect on the corrosion potential, but decreases the pitting potential markedly and increases the passive current densities. The analysis of energy-dispersive X-ray for samples adsorbing fibrinogen exhibits that the elements of O, C and N exist on the surface of Ti-Ni alloy. Furthermore, the scanning electron microscope micrographs confirm that the configuration of the adsorbing fibrinogen concentrating on surface defects is like cluster and the fibrinogen adsorption concentration is 96.67 mg/m(2) through ultroviolet ray absorption method. Fibrinogen combined with Ti-Ni alloy surface by complex band and its electrochemical transfer accelerated the corrosion of alloy.
关键词Ti-Ni shape memory alloy fibrinogen electrochemical behavior adsorption
收录类别SCI
语种英语
WOS研究方向Metallurgy & Metallurgical Engineering
WOS类目Metallurgy & Metallurgical Engineering
WOS记录号WOS:000220034600007
出版者ALLERTON PRESS INC
引用统计
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/80842
通讯作者Liang, CH
作者单位1.Dalian Univ Technol, Sch Chem Engn, Dalian 116012, Peoples R China
2.State Key Lab Corros & Protect, Shenyang 110016, Peoples R China
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GB/T 7714
Liang, CH,Guo, HX,Chen, BY. Electrochemical behavior of Ti-Ni shape memory alloy in fibrinogen solution[J]. TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA,2004,14(1):33-36.
APA Liang, CH,Guo, HX,&Chen, BY.(2004).Electrochemical behavior of Ti-Ni shape memory alloy in fibrinogen solution.TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA,14(1),33-36.
MLA Liang, CH,et al."Electrochemical behavior of Ti-Ni shape memory alloy in fibrinogen solution".TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA 14.1(2004):33-36.
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