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Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles
Zhao, Meng; Zhang, Liang; Liu, Zhi-quan; Xiong, Ming-yue; Sun, Lei; Jiang, Nan; Xu, Kai-kai
2019-08-01
Source PublicationJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
ISSN0957-4522
Volume30Issue:16Pages:15054-15063
AbstractWith the purpose of improving the properties of the Sn-3.8Ag-0.7Cu lead-free solder 0.5 wt% micro-CuZnAl particles were added. The experimental results showed that CuZnAl particles had little effect on the melting characteristics of Sn-3.8Ag-0.7Cu alloy. With the addition of CuZnAl particles, the tensile and shear stresses of solder joints were increased by 21% and 19%, respectively, and the microstructure matrix was refined obviously. However, the spreading area of solder was reduced by 7.2% and 3.6% at 230 degrees C and 250 degrees C on Cu substrates, respectively. In addition, the effect of CuZnAl particles on the growth of interfacial IMCs in the structure of Cu/Sn-3.8Ag-0.7Cu/Cu solder joints was studied. The results showed that the addition of 0.5 wt% CuZnAl particles could inhibit the growth of IMCs layer and the formation of voids.
Indexed BySCI
Language英语
WOS IDWOS:000480558400025
PublisherSPRINGER
Citation statistics
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/80858
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
Zhao, Meng,Zhang, Liang,Liu, Zhi-quan,et al. Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30(16):15054-15063.
APA Zhao, Meng.,Zhang, Liang.,Liu, Zhi-quan.,Xiong, Ming-yue.,Sun, Lei.,...&Xu, Kai-kai.(2019).Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,30(16),15054-15063.
MLA Zhao, Meng,et al."Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 30.16(2019):15054-15063.
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