IMR OpenIR
Magnetic-field induced anisotropy in electromigration behavior of Sn-Ag-Cu solder interconnects
Chen, Jian-Qiang1; Guo, Jing-Dong1; Ma, Hui-Cai1; Liu, Kai-Lang1; Zhu, Qing-sheng1; Shang, Jian Ku1,2
Corresponding AuthorGuo, Jing-Dong(jdguo@imr.ac.cn)
2015-04-28
Source PublicationJOURNAL OF MATERIALS RESEARCH
ISSN0884-2914
Volume30Issue:8Pages:1065-1071
AbstractSn-Ag-Cu solder interconnects were made by solidifying the solder balls in a magnetic field and subsequently tested for their electromigration behavior. The orientation of the tin grains was analyzed by electron backscattered diffraction. It was found that the c-axis of Sn grain tended to rotate away from the direction of the magnetic field during solidification, resulting in an enhanced electromigration resistance for the solder joint when the current was applied along the direction of the magnetic field, as evidenced by a smaller electromigration-induced polarity effect in the growth of the interfacial intermetallic compound. Such a reduced polarity-effect of electromigration is shown to agree well with the anisotropy in the diffusivity of the active diffusion species, Cu, in the tetragonal Sn. The difference of free energy change caused by the anisotropy in the magnetic susceptibility of the tetragonal Sn during solidification is suggested to be the main factor for this phenomenon.
Funding OrganizationNational Basic Research Program of China ; Natural Science Foundation of China ; Major National Science and Technology Program of China ; National key scientific instrument and equipment development projects of China ; Natural Science Foundation of Liaoning Province
DOI10.1557/jmr.2015.85
Indexed BySCI
Language英语
Funding ProjectNational Basic Research Program of China[2010CB631006] ; Natural Science Foundation of China[51171191] ; Natural Science Foundation of China[51101161] ; Major National Science and Technology Program of China[2011ZX02602] ; National key scientific instrument and equipment development projects of China[2013YQ120355] ; Natural Science Foundation of Liaoning Province[2013020015]
WOS Research AreaMaterials Science
WOS SubjectMaterials Science, Multidisciplinary
WOS IDWOS:000355282900003
PublisherCAMBRIDGE UNIV PRESS
Citation statistics
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/81127
Corresponding AuthorGuo, Jing-Dong
Affiliation1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
2.Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA
Recommended Citation
GB/T 7714
Chen, Jian-Qiang,Guo, Jing-Dong,Ma, Hui-Cai,et al. Magnetic-field induced anisotropy in electromigration behavior of Sn-Ag-Cu solder interconnects[J]. JOURNAL OF MATERIALS RESEARCH,2015,30(8):1065-1071.
APA Chen, Jian-Qiang,Guo, Jing-Dong,Ma, Hui-Cai,Liu, Kai-Lang,Zhu, Qing-sheng,&Shang, Jian Ku.(2015).Magnetic-field induced anisotropy in electromigration behavior of Sn-Ag-Cu solder interconnects.JOURNAL OF MATERIALS RESEARCH,30(8),1065-1071.
MLA Chen, Jian-Qiang,et al."Magnetic-field induced anisotropy in electromigration behavior of Sn-Ag-Cu solder interconnects".JOURNAL OF MATERIALS RESEARCH 30.8(2015):1065-1071.
Files in This Item:
There are no files associated with this item.
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[Chen, Jian-Qiang]'s Articles
[Guo, Jing-Dong]'s Articles
[Ma, Hui-Cai]'s Articles
Baidu academic
Similar articles in Baidu academic
[Chen, Jian-Qiang]'s Articles
[Guo, Jing-Dong]'s Articles
[Ma, Hui-Cai]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[Chen, Jian-Qiang]'s Articles
[Guo, Jing-Dong]'s Articles
[Ma, Hui-Cai]'s Articles
Terms of Use
No data!
Social Bookmark/Share
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.