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Evolution of the interfacial microstructure during the plastic deformation bonding of copper
Zhang, Jian Yang; Sun, Ming Yue; Xu, Bin; Hu, Xin; Liu, Sheng; Xie, Bi Jun; Li, Dian Zhong
2019-02-11
Source PublicationMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN0921-5093
Volume746Pages:1-10
AbstractIn order to clarify the bonding mechanism by plastic deformation of two similar materials, the microstructural evolution of the copper-copper interface by hot compression was investigated in detail. Particular attention was given to the development of new recrystallized grains in the bonding area and the elimination of the bonding line by the migration of interfacial grain boundaries (IGBs) during the hot compression process. The evolution of new grains in the matrix and the interface occur via different types of dynamic recrystallization (DRX). The former is associated with the grain boundary bulging and the latter is related to a strain induced substructure. This substructure is composed of a dislocation wall, and is transformed into recrystallized grain by the evolution of high angular misorientations after increasing strain. Two types of interfaces with different grain size features, such as a fine-fine grain or a fine-coarse grain interface, will be generated owing to different degrees of re crystallization occurring at the interface. The bonding mechanisms of the two different structural interfaces are also discussed.
KeywordCopper bonding Hot compression bonding Dynamic recrystallization Grain boundary Dislocation wall
Indexed BySCI
Language英语
WOS IDWOS:000458227900001
PublisherELSEVIER SCIENCE SA
Citation statistics
Cited Times:1[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/81377
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
Zhang, Jian Yang,Sun, Ming Yue,Xu, Bin,et al. Evolution of the interfacial microstructure during the plastic deformation bonding of copper[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2019,746:1-10.
APA Zhang, Jian Yang.,Sun, Ming Yue.,Xu, Bin.,Hu, Xin.,Liu, Sheng.,...&Li, Dian Zhong.(2019).Evolution of the interfacial microstructure during the plastic deformation bonding of copper.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,746,1-10.
MLA Zhang, Jian Yang,et al."Evolution of the interfacial microstructure during the plastic deformation bonding of copper".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 746(2019):1-10.
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