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Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics
Li, Cai-Fu; Li, Wanli; Zhang, Hao; Liu, Jinting; Yang, Yang; Li, Lingying; Gao, Yue; Liu, Zhi-Quan; Suganuma, Katsuaki
2019-01-23
Source PublicationACS APPLIED MATERIALS & INTERFACES
ISSN1944-8244
Volume11Issue:3Pages:3231-3240
AbstractStretchable wiring and stretchable bonding between a rigid chip/component and a stretchable substrate are two key factors for stretchable electronics. In this study, a highly conductive stretchable paste has been developed with commercial Ag microflakes and poly(dimethylsiloxane), which can be used to fabricate stretchable wirings and bondings under a low curing temperature of 100 degrees C with printing method. Herein, recoverabilities as to recovery time and recovery resistance of the wirings are defined and discussed. The effect of Ag composition and the tensile strain rate on the recoverability of the wirings are also examined. The wiring with a low resistivity of 8.7 x 10(-5) Omega cm shows much better recoverability than nanowire-based wirings due to the flake nature of the Ag particles. When stretched to 50 and 100% of strain, the resistance of the patterned wiring increases by only 10 and 110%, respectively. Moreover, the resistance of the wiring during 20% tensile cyclic test remains within 1.1 times even after 1000 cycles, thus demonstrating significant durability. The paste was utilized to fabricate conductive tracks and stretchable bondings to assemble a rigid chip to fabricate a stretchable demo. When stretched to 50% of strain, resistance of the wiring was increased by 90%. It is anticipated that the newly developed paste will be used to fabricate various stretchable wirings, bondings, and packaging structures by a simple printing process, thus enabling mass production of stretchable electronic devices.
Keywordconductive pastes stretchable wirings stretchable bonding Ag microflakes recoverability
Indexed BySCI
Language英语
WOS IDWOS:000457067300077
PublisherAMER CHEMICAL SOC
Citation statistics
Cited Times:11[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/81439
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
Li, Cai-Fu,Li, Wanli,Zhang, Hao,et al. Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics[J]. ACS APPLIED MATERIALS & INTERFACES,2019,11(3):3231-3240.
APA Li, Cai-Fu.,Li, Wanli.,Zhang, Hao.,Liu, Jinting.,Yang, Yang.,...&Suganuma, Katsuaki.(2019).Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics.ACS APPLIED MATERIALS & INTERFACES,11(3),3231-3240.
MLA Li, Cai-Fu,et al."Highly Conductive Ag Paste for Recoverable Wiring and Reliable Bonding Used in Stretchable Electronics".ACS APPLIED MATERIALS & INTERFACES 11.3(2019):3231-3240.
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