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| Brittle-to-ductile transition of Au2Al and AuAl2 intermetallic compounds in wire bonding | |
| Yang, Haokun; Cao, Ke; Zhao, XiaoTian; Liu, Wei; Lu, Jian; Lu, Yang | |
| 2019 | |
| Source Publication | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
 |
| ISSN | 0957-4522 |
| Volume | 30Issue:1Pages:862-866 |
| Abstract | Au-Al intermetallic compounds (IMCs) were conventionally regarded as damage sources within wire bonding interfaces. Among the Au-Al IMCs system, Au2Al and AuAl2 IMCs were commonly observed after long-term service. Here, the intrinsic mechanical properties of Au2Al and AuAl2 IMCs were investigated by in-situ bending tests. The results clearly revealed that the transition from brittle to ductile facture behavior was determined by the atomic ratio of Au and Al elements, while Al-rich Au-Al IMC exhibits higher bending strength than that of Au-rich Au-Al IMC. The Al-rich Au-Al IMC such as AuAl2 indeed showed brittle fracture behavior, in which cracks propagated through the grain boundaries. In contrast, the Au-rich Au-Al IMC such as Au2Al appeared to be quite ductile and crack resistant, and its plastic deformation was undertaken by slip bands. This work suggested that not all Au-Al IMCs cause brittleness and lead to damages, only Al-rich IMCs should be avoided at wire bonding interfaces. |
| Indexed By | SCI |
| Language | 英语 |
| WOS ID | WOS:000456048800092 |
| Publisher | SPRINGER |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/81491 |
| Collection | 中国科学院金属研究所 |
| Recommended Citation GB/T 7714 | Yang, Haokun,Cao, Ke,Zhao, XiaoTian,et al. Brittle-to-ductile transition of Au2Al and AuAl2 intermetallic compounds in wire bonding[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30(1):862-866. |
| APA | Yang, Haokun,Cao, Ke,Zhao, XiaoTian,Liu, Wei,Lu, Jian,&Lu, Yang.(2019).Brittle-to-ductile transition of Au2Al and AuAl2 intermetallic compounds in wire bonding.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,30(1),862-866. |
| MLA | Yang, Haokun,et al."Brittle-to-ductile transition of Au2Al and AuAl2 intermetallic compounds in wire bonding".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 30.1(2019):862-866. |
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