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Brittle-to-ductile transition of Au2Al and AuAl2 intermetallic compounds in wire bonding
Yang, Haokun; Cao, Ke; Zhao, XiaoTian; Liu, Wei; Lu, Jian; Lu, Yang
2019
Source PublicationJOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
ISSN0957-4522
Volume30Issue:1Pages:862-866
AbstractAu-Al intermetallic compounds (IMCs) were conventionally regarded as damage sources within wire bonding interfaces. Among the Au-Al IMCs system, Au2Al and AuAl2 IMCs were commonly observed after long-term service. Here, the intrinsic mechanical properties of Au2Al and AuAl2 IMCs were investigated by in-situ bending tests. The results clearly revealed that the transition from brittle to ductile facture behavior was determined by the atomic ratio of Au and Al elements, while Al-rich Au-Al IMC exhibits higher bending strength than that of Au-rich Au-Al IMC. The Al-rich Au-Al IMC such as AuAl2 indeed showed brittle fracture behavior, in which cracks propagated through the grain boundaries. In contrast, the Au-rich Au-Al IMC such as Au2Al appeared to be quite ductile and crack resistant, and its plastic deformation was undertaken by slip bands. This work suggested that not all Au-Al IMCs cause brittleness and lead to damages, only Al-rich IMCs should be avoided at wire bonding interfaces.
Indexed BySCI
Language英语
WOS IDWOS:000456048800092
PublisherSPRINGER
Citation statistics
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/81491
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
Yang, Haokun,Cao, Ke,Zhao, XiaoTian,et al. Brittle-to-ductile transition of Au2Al and AuAl2 intermetallic compounds in wire bonding[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30(1):862-866.
APA Yang, Haokun,Cao, Ke,Zhao, XiaoTian,Liu, Wei,Lu, Jian,&Lu, Yang.(2019).Brittle-to-ductile transition of Au2Al and AuAl2 intermetallic compounds in wire bonding.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,30(1),862-866.
MLA Yang, Haokun,et al."Brittle-to-ductile transition of Au2Al and AuAl2 intermetallic compounds in wire bonding".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 30.1(2019):862-866.
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