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High-performance bulk Ti-Cu-Ni-Sn-Ta nanocomposites based on a dendrite-eutectic microstructure
Dai, QL; Sun, BB; Sui, ML; He, G; Li, Y; Eckert, J; Luo, WK; Ma, E
Corresponding AuthorSui, ML(mlsui@imr.ac.cn)
2004-09-01
Source PublicationJOURNAL OF MATERIALS RESEARCH
ISSN0884-2914
Volume19Issue:9Pages:2557-2566
AbstractUsing a Ti-Cu-Ni-Sn-Ta alloy as an example, we demonstrate a strategy for the in situ formation of nanocomposite microstructures that can lead to simultaneous high strength and ductility. Our approach employs copper mold casting for the production of bulk alloys from the melt, and the solidification microstructure is designed to be composed of micrometer-sized ductile dendrites uniformly distributed inside a matrix of nanoscale eutectic reaction products. The nanostructured matrix is achieved at a relatively deep eutectic, which facilitates the formation of an ultrafine eutectic microstructure over a range of cooling rates. The multi-component recipe stabilizes a ductile solid solution as the toughening phase and helps to reduce the eutectic spacing down to nanoscale. The multi-phase microstructure (including phase distributions, morphologies, and interfaces) has been examined in detail using transmission electron microscopy (TEM) and high-resolution TEM. The metastable eutectic reaction and the nanoscale spacing achieved are explained using thermodynamic and solidification modeling. The benefits expected from the microstructure design are illustrated using the high strength and large plasticity observed in mechanical property tests. Our nanocomposite design strategy is expected to be applicable to many alloy systems and constitutes another example of tailoring the microstructure on nanoscale for extraordinary properties.
DOI10.1557/JMR.2004.0332
Indexed BySCI
Language英语
WOS Research AreaMaterials Science
WOS SubjectMaterials Science, Multidisciplinary
WOS IDWOS:000223689000009
PublisherCAMBRIDGE UNIV PRESS
Citation statistics
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/81765
Corresponding AuthorSui, ML
Affiliation1.Chinese Acad Sci, Met Res Inst, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
2.Natl Inst Mat Sci, Light Mat Grp, Tsukuba, Ibaraki 3050047, Japan
3.Natl Univ Singapore, Dept Mat Sci, Singapore 117548, Singapore
4.Tech Univ Darmstadt, Div Phys Met, Dept Mat & GeoSci, D-64287 Darmstadt, Germany
5.Johns Hopkins Univ, Dept Mat Sci & Engn, Baltimore, MD 21218 USA
Recommended Citation
GB/T 7714
Dai, QL,Sun, BB,Sui, ML,et al. High-performance bulk Ti-Cu-Ni-Sn-Ta nanocomposites based on a dendrite-eutectic microstructure[J]. JOURNAL OF MATERIALS RESEARCH,2004,19(9):2557-2566.
APA Dai, QL.,Sun, BB.,Sui, ML.,He, G.,Li, Y.,...&Ma, E.(2004).High-performance bulk Ti-Cu-Ni-Sn-Ta nanocomposites based on a dendrite-eutectic microstructure.JOURNAL OF MATERIALS RESEARCH,19(9),2557-2566.
MLA Dai, QL,et al."High-performance bulk Ti-Cu-Ni-Sn-Ta nanocomposites based on a dendrite-eutectic microstructure".JOURNAL OF MATERIALS RESEARCH 19.9(2004):2557-2566.
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