| Damage behavior of 200-nm thin copper films under cyclic loading | |
| Zhang, GP; Volkert, CA; Schwaiger, R; Arzt, E; Kraft, O | |
| Corresponding Author | Zhang, GP(gpzhang@imr.ac.cn) |
| 2005 | |
| Source Publication | JOURNAL OF MATERIALS RESEARCH
 |
| ISSN | 0884-2914 |
| Volume | 20Issue:1Pages:201-207 |
| Abstract | Fatigue damage in 200-nm-thick Cu films was investigated and compared with the damage in thicker Cu films. The fatigued 200-nm-thick Cu films exhibited only a few, small extrusions and extensive cracking along twin and grain boundaries, whereas the thicker films showed many extrusions/intrusions and cracks lying along the extrusions rather than along the boundaries. This change in fatigue damage behavior with film thickness is attributed to the inhibition of dislocation mobility and the limited availability and activation of dislocation sources on the small length scale. It is argued that the decrease in film thickness and grain size inhibits the localized accumulation of plastic strain within grains, such as at extrusions/intrusions and in extended dislocation structures, and promotes the formation of damage such as cracks at twin and grain boundaries during fatigue. This effect is suggested as the likely cause for the increase in fatigue life with decreasing specimen dimensions. |
| DOI | 10.1557/JMR.2005.0019 |
| Indexed By | SCI |
| Language | 英语 |
| WOS Research Area | Materials Science |
| WOS Subject | Materials Science, Multidisciplinary |
| WOS ID | WOS:000229292600027 |
| Publisher | MATERIALS RESEARCH SOCIETY |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/82010 |
| Corresponding Author | Zhang, GP |
| Affiliation | 1.Max Planck Inst Metallforsch, D-70569 Stuttgart, Germany 2.Chinese Acad Sci, Inst Met Res, Lab Mat Sci, Shenyang 110016, Peoples R China 3.Forschungszentrum Karlshruhe, Inst Materialforschung 2, Karlsruhe, Germany 4.Max Planck Inst Metallforsch, D-70569 Stuttgart, Germany |
| Recommended Citation GB/T 7714 | Zhang, GP,Volkert, CA,Schwaiger, R,et al. Damage behavior of 200-nm thin copper films under cyclic loading[J]. JOURNAL OF MATERIALS RESEARCH,2005,20(1):201-207. |
| APA | Zhang, GP,Volkert, CA,Schwaiger, R,Arzt, E,&Kraft, O.(2005).Damage behavior of 200-nm thin copper films under cyclic loading.JOURNAL OF MATERIALS RESEARCH,20(1),201-207. |
| MLA | Zhang, GP,et al."Damage behavior of 200-nm thin copper films under cyclic loading".JOURNAL OF MATERIALS RESEARCH 20.1(2005):201-207. |
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