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Damage behavior of 200-nm thin copper films under cyclic loading
Zhang, GP; Volkert, CA; Schwaiger, R; Arzt, E; Kraft, O
Corresponding AuthorZhang, GP(gpzhang@imr.ac.cn)
2005
Source PublicationJOURNAL OF MATERIALS RESEARCH
ISSN0884-2914
Volume20Issue:1Pages:201-207
AbstractFatigue damage in 200-nm-thick Cu films was investigated and compared with the damage in thicker Cu films. The fatigued 200-nm-thick Cu films exhibited only a few, small extrusions and extensive cracking along twin and grain boundaries, whereas the thicker films showed many extrusions/intrusions and cracks lying along the extrusions rather than along the boundaries. This change in fatigue damage behavior with film thickness is attributed to the inhibition of dislocation mobility and the limited availability and activation of dislocation sources on the small length scale. It is argued that the decrease in film thickness and grain size inhibits the localized accumulation of plastic strain within grains, such as at extrusions/intrusions and in extended dislocation structures, and promotes the formation of damage such as cracks at twin and grain boundaries during fatigue. This effect is suggested as the likely cause for the increase in fatigue life with decreasing specimen dimensions.
DOI10.1557/JMR.2005.0019
Indexed BySCI
Language英语
WOS Research AreaMaterials Science
WOS SubjectMaterials Science, Multidisciplinary
WOS IDWOS:000229292600027
PublisherMATERIALS RESEARCH SOCIETY
Citation statistics
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/82010
Corresponding AuthorZhang, GP
Affiliation1.Max Planck Inst Metallforsch, D-70569 Stuttgart, Germany
2.Chinese Acad Sci, Inst Met Res, Lab Mat Sci, Shenyang 110016, Peoples R China
3.Forschungszentrum Karlshruhe, Inst Materialforschung 2, Karlsruhe, Germany
4.Max Planck Inst Metallforsch, D-70569 Stuttgart, Germany
Recommended Citation
GB/T 7714
Zhang, GP,Volkert, CA,Schwaiger, R,et al. Damage behavior of 200-nm thin copper films under cyclic loading[J]. JOURNAL OF MATERIALS RESEARCH,2005,20(1):201-207.
APA Zhang, GP,Volkert, CA,Schwaiger, R,Arzt, E,&Kraft, O.(2005).Damage behavior of 200-nm thin copper films under cyclic loading.JOURNAL OF MATERIALS RESEARCH,20(1),201-207.
MLA Zhang, GP,et al."Damage behavior of 200-nm thin copper films under cyclic loading".JOURNAL OF MATERIALS RESEARCH 20.1(2005):201-207.
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