Damage behavior of 200-nm thin copper films under cyclic loading

doi:10.1557/JMR.2005.0019

IMR OpenIR

	Damage behavior of 200-nm thin copper films under cyclic loading
	Zhang, GP ; Volkert, CA ; Schwaiger, R ; Arzt, E ; Kraft, O
通讯作者	Zhang, GP(gpzhang@imr.ac.cn)
	2005
发表期刊	JOURNAL OF MATERIALS RESEARCH
ISSN	0884-2914
卷号	20 期号:1 页码:201-207
摘要	Fatigue damage in 200-nm-thick Cu films was investigated and compared with the damage in thicker Cu films. The fatigued 200-nm-thick Cu films exhibited only a few, small extrusions and extensive cracking along twin and grain boundaries, whereas the thicker films showed many extrusions/intrusions and cracks lying along the extrusions rather than along the boundaries. This change in fatigue damage behavior with film thickness is attributed to the inhibition of dislocation mobility and the limited availability and activation of dislocation sources on the small length scale. It is argued that the decrease in film thickness and grain size inhibits the localized accumulation of plastic strain within grains, such as at extrusions/intrusions and in extended dislocation structures, and promotes the formation of damage such as cracks at twin and grain boundaries during fatigue. This effect is suggested as the likely cause for the increase in fatigue life with decreasing specimen dimensions.
DOI	10.1557/JMR.2005.0019
收录类别	SCI
语种	英语
WOS研究方向	Materials Science
WOS类目	Materials Science, Multidisciplinary
WOS记录号	WOS:000229292600027
出版者	MATERIALS RESEARCH SOCIETY
引用统计
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/82010
通讯作者	Zhang, GP
作者单位	1.Max Planck Inst Metallforsch, D-70569 Stuttgart, Germany 2.Chinese Acad Sci, Inst Met Res, Lab Mat Sci, Shenyang 110016, Peoples R China 3.Forschungszentrum Karlshruhe, Inst Materialforschung 2, Karlsruhe, Germany 4.Max Planck Inst Metallforsch, D-70569 Stuttgart, Germany
推荐引用方式 GB/T 7714	Zhang, GP,Volkert, CA,Schwaiger, R,et al. Damage behavior of 200-nm thin copper films under cyclic loading[J]. JOURNAL OF MATERIALS RESEARCH,2005,20(1):201-207.
APA	Zhang, GP,Volkert, CA,Schwaiger, R,Arzt, E,&Kraft, O.(2005).Damage behavior of 200-nm thin copper films under cyclic loading.JOURNAL OF MATERIALS RESEARCH,20(1),201-207.
MLA	Zhang, GP,et al."Damage behavior of 200-nm thin copper films under cyclic loading".JOURNAL OF MATERIALS RESEARCH 20.1(2005):201-207.