High-performance bulk Ti-Cu-Ni-Sn-Ta nanocomposites based on a dendrite-eutectic microstructure

doi:10.1557/JMR.2004.0332

IMR OpenIR

	High-performance bulk Ti-Cu-Ni-Sn-Ta nanocomposites based on a dendrite-eutectic microstructure
	Dai, QL ; Sun, BB ; Sui, ML ; He, G ; Li, Y ; Eckert, J ; Luo, WK ; Ma, E
通讯作者	Sui, ML(mlsui@imr.ac.cn)
	2004-09-01
发表期刊	JOURNAL OF MATERIALS RESEARCH
ISSN	0884-2914
卷号	19 期号:9 页码:2557-2566
摘要	Using a Ti-Cu-Ni-Sn-Ta alloy as an example, we demonstrate a strategy for the in situ formation of nanocomposite microstructures that can lead to simultaneous high strength and ductility. Our approach employs copper mold casting for the production of bulk alloys from the melt, and the solidification microstructure is designed to be composed of micrometer-sized ductile dendrites uniformly distributed inside a matrix of nanoscale eutectic reaction products. The nanostructured matrix is achieved at a relatively deep eutectic, which facilitates the formation of an ultrafine eutectic microstructure over a range of cooling rates. The multi-component recipe stabilizes a ductile solid solution as the toughening phase and helps to reduce the eutectic spacing down to nanoscale. The multi-phase microstructure (including phase distributions, morphologies, and interfaces) has been examined in detail using transmission electron microscopy (TEM) and high-resolution TEM. The metastable eutectic reaction and the nanoscale spacing achieved are explained using thermodynamic and solidification modeling. The benefits expected from the microstructure design are illustrated using the high strength and large plasticity observed in mechanical property tests. Our nanocomposite design strategy is expected to be applicable to many alloy systems and constitutes another example of tailoring the microstructure on nanoscale for extraordinary properties.
DOI	10.1557/JMR.2004.0332
收录类别	SCI
语种	英语
WOS研究方向	Materials Science
WOS类目	Materials Science, Multidisciplinary
WOS记录号	WOS:000223689000009
出版者	CAMBRIDGE UNIV PRESS
引用统计
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/82212
通讯作者	Sui, ML
作者单位	1.Chinese Acad Sci, Met Res Inst, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Natl Inst Mat Sci, Light Mat Grp, Tsukuba, Ibaraki 3050047, Japan 3.Natl Univ Singapore, Dept Mat Sci, Singapore 117548, Singapore 4.Tech Univ Darmstadt, Div Phys Met, Dept Mat & GeoSci, D-64287 Darmstadt, Germany 5.Johns Hopkins Univ, Dept Mat Sci & Engn, Baltimore, MD 21218 USA
推荐引用方式 GB/T 7714	Dai, QL,Sun, BB,Sui, ML,et al. High-performance bulk Ti-Cu-Ni-Sn-Ta nanocomposites based on a dendrite-eutectic microstructure[J]. JOURNAL OF MATERIALS RESEARCH,2004,19(9):2557-2566.
APA	Dai, QL.,Sun, BB.,Sui, ML.,He, G.,Li, Y.,...&Ma, E.(2004).High-performance bulk Ti-Cu-Ni-Sn-Ta nanocomposites based on a dendrite-eutectic microstructure.JOURNAL OF MATERIALS RESEARCH,19(9),2557-2566.
MLA	Dai, QL,et al."High-performance bulk Ti-Cu-Ni-Sn-Ta nanocomposites based on a dendrite-eutectic microstructure".JOURNAL OF MATERIALS RESEARCH 19.9(2004):2557-2566.