Study of novel electronic packaging material 70%Si-Al prepared by the spray deposition

IMR OpenIR

	Study of novel electronic packaging material 70%Si-Al prepared by the spray deposition
	Wang, XF; Zhao, JZ; Tian, C
通讯作者	Zhao, JZ()
	2005-12-01
发表期刊	ACTA METALLURGICA SINICA
ISSN	0412-1961
卷号	41 期号:12 页码:1277-1279
摘要	70%Si-Al alloy as a novel electronics package material was prepared by spray deposition. HIP technique was adopted in order to density the billet. The prepared 70%Si-Al alloy has a microstructure with fine silicon particles (10-20 mu m in diameter) well dispersed in the matrix. The alloy shows excellent comprehensive properties, especially a lower thermal expansion coefficient and a lower density compared with the traditional electronics packaging materials. After HIP, The comprehensive properties of the 70%Si-Al alloy can be further enhanced. The alloy can be machined with the traditional cutting tools and applied as the packaging materials for the power IC, microwave electronic parts and integrate circuit blocks.
关键词	70%Si-Al alloy electronics package material spray deposition hot isostatic pressing (HIP) thermal expansion
收录类别	SCI
语种	英语
WOS研究方向	Metallurgy & Metallurgical Engineering
WOS类目	Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000234521500008
出版者	SCIENCE PRESS
引用统计	被引频次：2[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/82259
专题	中国科学院金属研究所
通讯作者	Zhao, JZ
作者单位	Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Wang, XF,Zhao, JZ,Tian, C. Study of novel electronic packaging material 70%Si-Al prepared by the spray deposition[J]. ACTA METALLURGICA SINICA,2005,41(12):1277-1279.
APA	Wang, XF,Zhao, JZ,&Tian, C.(2005).Study of novel electronic packaging material 70%Si-Al prepared by the spray deposition.ACTA METALLURGICA SINICA,41(12),1277-1279.
MLA	Wang, XF,et al."Study of novel electronic packaging material 70%Si-Al prepared by the spray deposition".ACTA METALLURGICA SINICA 41.12(2005):1277-1279.