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Ultrahigh strength and high electrical conductivity in copper
Lu, L; Shen, YF; Chen, XH; Qian, LH; Lu, K
通讯作者Lu, K()
2004-04-16
发表期刊SCIENCE
ISSN0036-8075
卷号304期号:5669页码:422-426
摘要Methods used to strengthen metals generally also cause a pronounced decrease in electrical conductivity, so that a tradeoff must be made between conductivity and mechanical strength. We synthesized pure copper samples with a high density of nanoscale growth twins. They showed a tensile strength about 10 times higher than that of conventional coarse-grained copper, while retaining an electrical conductivity comparable to that of pure copper. The ultrahigh strength originates from the effective blockage of dislocation motion by numerous coherent twin boundaries that possess an extremely low electrical resistivity, which is not the case for other types of grain boundaries.
收录类别SCI
语种英语
WOS研究方向Science & Technology - Other Topics
WOS类目Multidisciplinary Sciences
WOS记录号WOS:000220845400043
出版者AMER ASSOC ADVANCEMENT SCIENCE
引用统计
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/82346
通讯作者Lu, K
作者单位Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
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GB/T 7714
Lu, L,Shen, YF,Chen, XH,et al. Ultrahigh strength and high electrical conductivity in copper[J]. SCIENCE,2004,304(5669):422-426.
APA Lu, L,Shen, YF,Chen, XH,Qian, LH,&Lu, K.(2004).Ultrahigh strength and high electrical conductivity in copper.SCIENCE,304(5669),422-426.
MLA Lu, L,et al."Ultrahigh strength and high electrical conductivity in copper".SCIENCE 304.5669(2004):422-426.
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