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Ultrahigh strength and high electrical conductivity in copper
Lu, L; Shen, YF; Chen, XH; Qian, LH; Lu, K
Corresponding AuthorLu, K()
2004-04-16
Source PublicationSCIENCE
ISSN0036-8075
Volume304Issue:5669Pages:422-426
AbstractMethods used to strengthen metals generally also cause a pronounced decrease in electrical conductivity, so that a tradeoff must be made between conductivity and mechanical strength. We synthesized pure copper samples with a high density of nanoscale growth twins. They showed a tensile strength about 10 times higher than that of conventional coarse-grained copper, while retaining an electrical conductivity comparable to that of pure copper. The ultrahigh strength originates from the effective blockage of dislocation motion by numerous coherent twin boundaries that possess an extremely low electrical resistivity, which is not the case for other types of grain boundaries.
Indexed BySCI
Language英语
WOS Research AreaScience & Technology - Other Topics
WOS SubjectMultidisciplinary Sciences
WOS IDWOS:000220845400043
PublisherAMER ASSOC ADVANCEMENT SCIENCE
Citation statistics
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/82346
Corresponding AuthorLu, K
AffiliationChinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
Recommended Citation
GB/T 7714
Lu, L,Shen, YF,Chen, XH,et al. Ultrahigh strength and high electrical conductivity in copper[J]. SCIENCE,2004,304(5669):422-426.
APA Lu, L,Shen, YF,Chen, XH,Qian, LH,&Lu, K.(2004).Ultrahigh strength and high electrical conductivity in copper.SCIENCE,304(5669),422-426.
MLA Lu, L,et al."Ultrahigh strength and high electrical conductivity in copper".SCIENCE 304.5669(2004):422-426.
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