Thermal fatigue crack initiation in K465 superalloy | |
Yang, JX; Zheng, Q; Sun, XF; Guan, HR; Hu, ZQ | |
通讯作者 | Yang, JX(jxyang@imr.ac.cn) |
2005-11-01 | |
发表期刊 | TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA
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ISSN | 1003-6326 |
卷号 | 15页码:71-76 |
摘要 | Thermal fatigue crack initiation of K465 superalloy was studied by optical microscope and scanning electron microscope(SEM). The maximum temperature and its corresponding holding time during thermal fatigue were respectively 950 degrees C for 100 s and 300 s, 1 000 degrees C for 100 s and 1 050 degrees C for 100 s and 300 s. The minimum temperature was 20 degrees C. The data of initiation lives shows that increasing the maximum temperature or holding time at peak temperature decreases, decreases TF crack initiation life and the effect of holding time is more distinct than that of peak temperature. The metallographic observation presents that TF crack initiates at voids aggregation damage zones(VADZs), carbide fracture damage zones(CFDZs). cracked carbide and phases interface. VADZs basically result from creep fatigue interaction deformation whereas CFDZs is mainly induced by oxidation. |
关键词 | thermal fatigue oxidation creep crack initiation |
收录类别 | SCI |
语种 | 英语 |
WOS研究方向 | Metallurgy & Metallurgical Engineering |
WOS类目 | Metallurgy & Metallurgical Engineering |
WOS记录号 | WOS:000233494100016 |
出版者 | ALLERTON PRESS INC |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://ir.imr.ac.cn/handle/321006/82492 |
通讯作者 | Yang, JX |
作者单位 | Chinese Acad Sci, Met Res Inst, Shenyang 110016, Peoples R China |
推荐引用方式 GB/T 7714 | Yang, JX,Zheng, Q,Sun, XF,et al. Thermal fatigue crack initiation in K465 superalloy[J]. TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA,2005,15:71-76. |
APA | Yang, JX,Zheng, Q,Sun, XF,Guan, HR,&Hu, ZQ.(2005).Thermal fatigue crack initiation in K465 superalloy.TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA,15,71-76. |
MLA | Yang, JX,et al."Thermal fatigue crack initiation in K465 superalloy".TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA 15(2005):71-76. |
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