Introduction of helium into metals by magnetron sputtering deposition method | |
Zheng, H; Liu, S; Yu, HB; Wang, LB; Liu, CZ; Shi, LQ | |
Corresponding Author | Zheng, H(zhenghua@imr.ac.cn) |
2005-04-01 | |
Source Publication | MATERIALS LETTERS
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ISSN | 0167-577X |
Volume | 59Issue:8-9Pages:1071-1075 |
Abstract | High concentration helium, up to 16 at.%, was introduced into Ti films through magnetron sputtering method in a He/Ar complex atmosphere. The introduced helium distributes homogeneously in the films and mainly forms small helium bubbles. Helium thermodesorption experiments were carried out, from which it was found that the thermodesorption properties of the introduced 4 He are similar to those of radiogenic He-3 in titanium tritides. Titanium alloy films containing helium were also prepared through this way and a comparison of thermodesorption properties was made between them and Ti-He films. (C) 2004 Elsevier B.V. All rights reserved. |
Keyword | helium Ti film magnetron sputtering thermodesorption |
DOI | 10.1016/j.matlet.2004.13.008 |
Indexed By | SCI |
Language | 英语 |
WOS Research Area | Materials Science ; Physics |
WOS Subject | Materials Science, Multidisciplinary ; Physics, Applied |
WOS ID | WOS:000227164000048 |
Publisher | ELSEVIER SCIENCE BV |
Citation statistics | |
Document Type | 期刊论文 |
Identifier | http://ir.imr.ac.cn/handle/321006/82513 |
Corresponding Author | Zheng, H |
Affiliation | 1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China 2.Fudan Univ, Inst Modern Phys, Shanghai 200433, Peoples R China |
Recommended Citation GB/T 7714 | Zheng, H,Liu, S,Yu, HB,et al. Introduction of helium into metals by magnetron sputtering deposition method[J]. MATERIALS LETTERS,2005,59(8-9):1071-1075. |
APA | Zheng, H,Liu, S,Yu, HB,Wang, LB,Liu, CZ,&Shi, LQ.(2005).Introduction of helium into metals by magnetron sputtering deposition method.MATERIALS LETTERS,59(8-9),1071-1075. |
MLA | Zheng, H,et al."Introduction of helium into metals by magnetron sputtering deposition method".MATERIALS LETTERS 59.8-9(2005):1071-1075. |
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