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Light and strong nano-SiC foam with extremely low thermal conductivity
Liang, Xianpeng; Wan, Peng; Wu, Zhen; Lei, Yiming; Wang, Jingyang
2020-09-01
Source PublicationMATERIALS LETTERS
Volume274
AbstractWe herein report a porous nano-SiC foam fabricated by foam-gelcasting-freeze drying method with ultra-high porosity (96%). Porous nano-SiC sintered at 1300 degrees C and 1400 degrees C exhibit excellent balanced high compressive strength (1.44 MPa) and low thermal conductivity (0.064 W/(m.K)). The porous nano-SiC can be invoked as a candidate for high temperature thermal insulation. The low thermal conductivity mainly originates in the high porosity and the strong scattering of phonons by the nanostructure of the skeleton.
DOI10.1016/j.matlet.2020.128017
WOS IDWOS:000541705400006
Citation statistics
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/82592
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
Liang, Xianpeng,Wan, Peng,Wu, Zhen,et al. Light and strong nano-SiC foam with extremely low thermal conductivity[J]. MATERIALS LETTERS,2020,274.
APA Liang, Xianpeng,Wan, Peng,Wu, Zhen,Lei, Yiming,&Wang, Jingyang.(2020).Light and strong nano-SiC foam with extremely low thermal conductivity.MATERIALS LETTERS,274.
MLA Liang, Xianpeng,et al."Light and strong nano-SiC foam with extremely low thermal conductivity".MATERIALS LETTERS 274(2020).
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