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Role of Cu/graphene interface in suppressing fatigue damage of submicron Cu films for flexible electronics
Yang, Yu-Jia; Zhang, Bin; Wan, Hong-Yuan; Zhang, Guang-Ping
2020-08-05
Source PublicationMATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
Volume792
AbstractTo enhance the mechanical reliability without sacrificing the electrical conductivity of the flexible electronics, in this work submicmn-thick Cu/Au/PI (CAP) and graphene/Cu/Au/PI (GCAP) films were fabricated successfully by using a series of assembly methods through introducing a graphene passivation layer onto the polyimide (PI)-supported Cu film surface, and a nanoscale gold (Au) interlayer between the Cu/PI interface. Tensile testing results reveal that the yield strength, the fracture strain and the electrical properties of the GCAP film were improved simultaneously. Furthermore, the GCAP film also exhibited a higher fatigue strength than the CAP film. The basic mechanism is mainly attributed to the effective suppression of the Cu/graphene interface on the fatigue extrusion formation through constraining dislocation motion.
DOI10.1016/j.msea.2020.139786
WOS IDWOS:000553980500026
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Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/82639
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
Yang, Yu-Jia,Zhang, Bin,Wan, Hong-Yuan,et al. Role of Cu/graphene interface in suppressing fatigue damage of submicron Cu films for flexible electronics[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2020,792.
APA Yang, Yu-Jia,Zhang, Bin,Wan, Hong-Yuan,&Zhang, Guang-Ping.(2020).Role of Cu/graphene interface in suppressing fatigue damage of submicron Cu films for flexible electronics.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,792.
MLA Yang, Yu-Jia,et al."Role of Cu/graphene interface in suppressing fatigue damage of submicron Cu films for flexible electronics".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 792(2020).
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