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Study of novel electronic packaging material 70%Si-Al prepared by the spray deposition
Wang, XF; Zhao, JZ; Tian, C
Corresponding AuthorZhao, JZ()
2005-12-01
Source PublicationACTA METALLURGICA SINICA
ISSN0412-1961
Volume41Issue:12Pages:1277-1279
Abstract70%Si-Al alloy as a novel electronics package material was prepared by spray deposition. HIP technique was adopted in order to density the billet. The prepared 70%Si-Al alloy has a microstructure with fine silicon particles (10-20 mu m in diameter) well dispersed in the matrix. The alloy shows excellent comprehensive properties, especially a lower thermal expansion coefficient and a lower density compared with the traditional electronics packaging materials. After HIP, The comprehensive properties of the 70%Si-Al alloy can be further enhanced. The alloy can be machined with the traditional cutting tools and applied as the packaging materials for the power IC, microwave electronic parts and integrate circuit blocks.
Keyword70%Si-Al alloy electronics package material spray deposition hot isostatic pressing (HIP) thermal expansion
Indexed BySCI
Language英语
WOS Research AreaMetallurgy & Metallurgical Engineering
WOS SubjectMetallurgy & Metallurgical Engineering
WOS IDWOS:000234521500008
PublisherSCIENCE PRESS
Citation statistics
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/82698
Corresponding AuthorZhao, JZ
AffiliationChinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China
Recommended Citation
GB/T 7714
Wang, XF,Zhao, JZ,Tian, C. Study of novel electronic packaging material 70%Si-Al prepared by the spray deposition[J]. ACTA METALLURGICA SINICA,2005,41(12):1277-1279.
APA Wang, XF,Zhao, JZ,&Tian, C.(2005).Study of novel electronic packaging material 70%Si-Al prepared by the spray deposition.ACTA METALLURGICA SINICA,41(12),1277-1279.
MLA Wang, XF,et al."Study of novel electronic packaging material 70%Si-Al prepared by the spray deposition".ACTA METALLURGICA SINICA 41.12(2005):1277-1279.
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