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| Microstructure formation and electrical resistivity behavior of rapidly solidified Cu-Fe-Zr immiscible alloys | |
| Sun, Xiaojun; He, Jie; Chen, Bin; Zhang, Lili; Jiang, Hongxiang; Zhao, Jiuzhou; Hao, Hongri | |
| 2020-05-01 | |
| Source Publication | JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
 |
| Volume | 44Pages:201-208 |
| Abstract | The immiscible Cu-Fe alloy was characterized by a metastable miscibility gap. With the addition element Zr, the miscibility gap can be extended into the Cu-Fe-Zr ternary system. The effect of the atomic ratio of Cu to Fe and Zr content on the behavior of liquid-liquid phase separation was studied. The results show that liquid-liquid phase separation into Cu-rich and Fe-rich liquids took place in the as-quenched Cu-Fe-Zr alloy. A glassy structure with nanoscale phase separation was obtained in the as-quenched (Cu0.5Fe0.5)(40)Zr-60 alloy sample, exhibiting a homogeneous distribution of glassy Cu-rich nanoparticles in glassy Fe-rich matrix. The microstructural evolution and the competitive mechanism of phase formation in the rapidly solidified Cu-Fe-Zr system were discussed in detail. Moreover, the electrical property of the as-quenched Cu-Fe-Zr alloy samples was examined. It displays an abnormal change of electrical resistivity upon temperature in the nanoscale-phase-separation metallic glass. The crystallization behavior of such metallic glass has been discussed. (C) 2020 Published by Elsevier Ltd on behalf of The editorial office of Journal of Materials Science & Technology. |
| DOI | 10.1016/j.jmst.2019.10.038 |
| WOS ID | WOS:000522863000021 |
| Citation statistics | |
| Document Type | 期刊论文 |
| Identifier | http://ir.imr.ac.cn/handle/321006/82890 |
| Collection | 中国科学院金属研究所 |
| Recommended Citation GB/T 7714 | Sun, Xiaojun,He, Jie,Chen, Bin,et al. Microstructure formation and electrical resistivity behavior of rapidly solidified Cu-Fe-Zr immiscible alloys[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2020,44:201-208. |
| APA | Sun, Xiaojun.,He, Jie.,Chen, Bin.,Zhang, Lili.,Jiang, Hongxiang.,...&Hao, Hongri.(2020).Microstructure formation and electrical resistivity behavior of rapidly solidified Cu-Fe-Zr immiscible alloys.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,44,201-208. |
| MLA | Sun, Xiaojun,et al."Microstructure formation and electrical resistivity behavior of rapidly solidified Cu-Fe-Zr immiscible alloys".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 44(2020):201-208. |
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