Effect of Hf addition in (Ni,Pt)Al bond coat on thermal cycling behavior of a thermal barrier coating system at 1100 degrees C

doi:10.1016/j.corsci.2019.108424

IMR OpenIR

	Effect of Hf addition in (Ni,Pt)Al bond coat on thermal cycling behavior of a thermal barrier coating system at 1100 degrees C
	Jiang, Chengyang; Li, Shuai; Liu, He; Bao, Zebin; Zhang, Jianqiang; Zhu, Shenglong; Wang, Fuhui
	2020-04-15
Source Publication	CORROSION SCIENCE
Volume	166
Abstract	Thermal cycling behavior of thermal barrier coatings deposited on Hf-doped (Ni,Pt)Al bond coats were investigated, comparing with conventional (Ni,Pt)Al at 1100 degrees C, to elucidate the effect of Hf addition into (Ni,Pt)Al bond coat on failure mode of TBCs. The results revealed that thermal cycling resistance of TBCs was significantly improved with addition of Hf, where relatively lower oxidation rate constant and decreased scale rumpling tendency were achieved. The effects of Hf incorporation on scale rumpling tendency and failure modes of the TBCs were discussed. Moreover, residual stress, Young's modulus and hardness in top coat were determined with increasing thermal cycles.
DOI	10.1016/j.corsci.2019.108424
WOS ID	WOS:000519652300007
Citation statistics	Cited Times:4[WOS] [WOS Record] [Related Records in WOS]
Document Type	期刊论文
Identifier	http://ir.imr.ac.cn/handle/321006/82955
Collection	中国科学院金属研究所
Recommended Citation GB/T 7714	Jiang, Chengyang,Li, Shuai,Liu, He,et al. Effect of Hf addition in (Ni,Pt)Al bond coat on thermal cycling behavior of a thermal barrier coating system at 1100 degrees C[J]. CORROSION SCIENCE,2020,166.
APA	Jiang, Chengyang.,Li, Shuai.,Liu, He.,Bao, Zebin.,Zhang, Jianqiang.,...&Wang, Fuhui.(2020).Effect of Hf addition in (Ni,Pt)Al bond coat on thermal cycling behavior of a thermal barrier coating system at 1100 degrees C.CORROSION SCIENCE,166.
MLA	Jiang, Chengyang,et al."Effect of Hf addition in (Ni,Pt)Al bond coat on thermal cycling behavior of a thermal barrier coating system at 1100 degrees C".CORROSION SCIENCE 166(2020).

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