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Electrical/thermal behaviors of bimetallic (Ag-Cu, Ag-Sn) nanoparticles for printed electronics
Wang, Xin; Huang, Feirong; Wang, Dongxing; Li, Da; Li, Pu; Muhammad, Javid; Dong, Xinglong; Zhang, Zhidong
2020-03-27
Source PublicationNANOTECHNOLOGY
Volume31Issue:13
AbstractIn this work, Ag-Cu and Ag-Sn nanoparticles (NPs) were synthesized by a physical vapor condensation method, i.e. DC arc-discharge plasma. The as-prepared bimetallic NPs consist of metallic cores of Ag-Cu or Ag-Sn and ultrathin oxide shells of CuO or a hybrid of SnO and SnO2. Ag-Sn NPs exhibit a room-temperature resistivity of 4.24 x 10(-5) omega cm, a little lower than 7.10 x 10(-5) omega cm of Ag-Cu NPs. Both bimetallic NPs demonstrate typical metallic conduction behavior with a positive temperature coefficient of resistance over 25-300 K. Ag-Sn NPs exhibit thermally competitive stability up to 230 degrees C and a lower resistivity of 3.18 x 10(-5) omega cm after sintering at 200 degrees C, giving it potential for application in flexible printed electronics.
DOI10.1088/1361-6528/ab5fed
WOS IDWOS:000520169000001
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Cited Times:1[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/83020
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
Wang, Xin,Huang, Feirong,Wang, Dongxing,et al. Electrical/thermal behaviors of bimetallic (Ag-Cu, Ag-Sn) nanoparticles for printed electronics[J]. NANOTECHNOLOGY,2020,31(13).
APA Wang, Xin.,Huang, Feirong.,Wang, Dongxing.,Li, Da.,Li, Pu.,...&Zhang, Zhidong.(2020).Electrical/thermal behaviors of bimetallic (Ag-Cu, Ag-Sn) nanoparticles for printed electronics.NANOTECHNOLOGY,31(13).
MLA Wang, Xin,et al."Electrical/thermal behaviors of bimetallic (Ag-Cu, Ag-Sn) nanoparticles for printed electronics".NANOTECHNOLOGY 31.13(2020).
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