IMR OpenIR
Highly solderability of FeP film in contact with SnAgCu solder
Zhou, Haifei; Guo, Jingdong; Shang, Jianku; Song, Xiaoning
2020-03-25
Source PublicationJOURNAL OF ALLOYS AND COMPOUNDS
Volume818
AbstractNew under bump metallization (UBM) is required for future microelectronics to minimize reliability concerns with solder interconnects. In this study, electroless FeP film was prepared as UBM. Solderability of electroless NiP, electrodeposite Fe and electroless FeP films with eutectic SnAgCu solder was investigated by static wetting tests and wetting balance measurements. Results revealed that the solderability of NiP film has almost no change with thermal aged for the film in air atmosphere increasing. The contact angles for FeP and Fe films with SnAgCu solder increased and the maximum wetting force decreased with heating time increasing from 0 h, 48 h, 89 h-160 h at 180 degrees C. But the solderability of FeP film was found to be better than those of NiP and Fe whether the films in base or thermal aged at 180 degrees C for 89 h. Even after thermal aged in air atmosphere at 180 degrees C for 160 h, the FeP also performed the smallest contace angle compared with the NiP and the Fe. Oxide layer on the surface of FeP was much easier to be removed by rosin mildly activated flux during reflow process because loose structure. It was proved to be the key for the highly solderability of electroless FeP. (C) 2019 Elsevier B.V. All rights reserved.
DOI10.1016/j.jallcom.2019.152900
WOS IDWOS:000506166900072
Citation statistics
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/83028
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
Zhou, Haifei,Guo, Jingdong,Shang, Jianku,et al. Highly solderability of FeP film in contact with SnAgCu solder[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2020,818.
APA Zhou, Haifei,Guo, Jingdong,Shang, Jianku,&Song, Xiaoning.(2020).Highly solderability of FeP film in contact with SnAgCu solder.JOURNAL OF ALLOYS AND COMPOUNDS,818.
MLA Zhou, Haifei,et al."Highly solderability of FeP film in contact with SnAgCu solder".JOURNAL OF ALLOYS AND COMPOUNDS 818(2020).
Files in This Item:
There are no files associated with this item.
Related Services
Recommend this item
Bookmark
Usage statistics
Export to Endnote
Google Scholar
Similar articles in Google Scholar
[Zhou, Haifei]'s Articles
[Guo, Jingdong]'s Articles
[Shang, Jianku]'s Articles
Baidu academic
Similar articles in Baidu academic
[Zhou, Haifei]'s Articles
[Guo, Jingdong]'s Articles
[Shang, Jianku]'s Articles
Bing Scholar
Similar articles in Bing Scholar
[Zhou, Haifei]'s Articles
[Guo, Jingdong]'s Articles
[Shang, Jianku]'s Articles
Terms of Use
No data!
Social Bookmark/Share
All comments (0)
No comment.
 

Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.