Microstructure and high-temperature creep behavior of NiAl-25 at.% Cr intermetallic compound

IMR OpenIR

	Microstructure and high-temperature creep behavior of NiAl-25 at.% Cr intermetallic compound
	Du, XH; Zhang, GY; Guo, JT
通讯作者	Du, XH(xinghaodu@yahoo.com)
	2005
发表期刊	PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5
ISSN	0255-5476
卷号	475-479 页码:771-774
摘要	The creep behavior and mechanisms of extruded NiAl-25Cr alloy at elevated temperatures have been studied in the paper. Analysis of the creep data over the temperature range 1073-1123 K reveals two distinct regions of creep behavior present in this material. At lower temperature, the creep characteristics are consistent with mobility-controlled deformation where viscous glide of dislocations controls creep. At higher temperature, the creep characteristics are consistent with a structure controlled creep process where some form of dislocation climb controls creep deformation.
关键词	NiAl-Cr alloy high-temperature creep microstructure mechanism
收录类别	SCI
语种	英语
WOS研究方向	Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目	Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000227494709177
出版者	TRANS TECH PUBLICATIONS LTD
引用统计
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/83034
通讯作者	Du, XH
作者单位	Chinese Acad Sci, Superalloys Div, Met Res Inst, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Du, XH,Zhang, GY,Guo, JT. Microstructure and high-temperature creep behavior of NiAl-25 at.% Cr intermetallic compound[J]. PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5,2005,475-479:771-774.
APA	Du, XH,Zhang, GY,&Guo, JT.(2005).Microstructure and high-temperature creep behavior of NiAl-25 at.% Cr intermetallic compound.PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5,475-479,771-774.
MLA	Du, XH,et al."Microstructure and high-temperature creep behavior of NiAl-25 at.% Cr intermetallic compound".PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5 475-479(2005):771-774.