Interfacial reaction between Cu and Ti2SnC during processing of Cu-Ti2SnC composite | |
Wu, JY; Zhou, YC; Wang, JY; Wang, W; Yan, CK | |
通讯作者 | Zhou, YC(yczhou@imr.ac.cn) |
2005-11-01 | |
发表期刊 | ZEITSCHRIFT FUR METALLKUNDE
![]() |
ISSN | 0044-3093 |
卷号 | 96期号:11页码:1314-1320 |
摘要 | Interfacial reaction between Cu and Ti2SnC during the processing of Cu - Ti2SnC composite was investigated by using X-ray diffraction, scanning electron microscopy, and transmission electron microscopy. It is shown that the reaction is closely related to the reaction temperature, reaction time, and relative ratio of Cu and Ti2SnC. The reacting products are Cu(Sn) solid solution and TiCx, and the transporting process during interfacial reaction is described. The interfacial reaction products are further confirmed by measuring the hardness across the interface using nanoindentation test. It is shown that the reaction is controlled by the de-intercalation of Sn from Ti2SnC to form Cu(Sn) solid solution and TiCx, and crystallographic relations of [011] TiCx // [010] Ti2SnC and (111) TiCx // (001) Ti2SnC were observed at the interface. The effect of interfacial reaction on the mechanical and electrical properties of the composite is also discussed. |
关键词 | interface copper Ti2SnC metal matrix composites |
收录类别 | SCI |
语种 | 英语 |
WOS研究方向 | Metallurgy & Metallurgical Engineering |
WOS类目 | Metallurgy & Metallurgical Engineering |
WOS记录号 | WOS:000234083000017 |
出版者 | CARL HANSER VERLAG |
引用统计 | |
文献类型 | 期刊论文 |
条目标识符 | http://ir.imr.ac.cn/handle/321006/83089 |
通讯作者 | Zhou, YC |
作者单位 | Chinese Acad Sci, Met Res Inst, Shenyang Natl Lab Mat Sci, High Performance Ceram Div, Shenyang 110016, Peoples R China |
推荐引用方式 GB/T 7714 | Wu, JY,Zhou, YC,Wang, JY,et al. Interfacial reaction between Cu and Ti2SnC during processing of Cu-Ti2SnC composite[J]. ZEITSCHRIFT FUR METALLKUNDE,2005,96(11):1314-1320. |
APA | Wu, JY,Zhou, YC,Wang, JY,Wang, W,&Yan, CK.(2005).Interfacial reaction between Cu and Ti2SnC during processing of Cu-Ti2SnC composite.ZEITSCHRIFT FUR METALLKUNDE,96(11),1314-1320. |
MLA | Wu, JY,et al."Interfacial reaction between Cu and Ti2SnC during processing of Cu-Ti2SnC composite".ZEITSCHRIFT FUR METALLKUNDE 96.11(2005):1314-1320. |
条目包含的文件 | 条目无相关文件。 |
除非特别说明,本系统中所有内容都受版权保护,并保留所有权利。
修改评论