Knowledge Management System Of Institute of metal research,CAS
Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process | |
Hua, Fu-an; Song, Hong-wu; Sun, Tao; Li, Jian-ping | |
2020-03-01 | |
Source Publication | METALS AND MATERIALS INTERNATIONAL
![]() |
Volume | 26Issue:3Pages:333-345 |
Abstract | A model based on inter-diffusion theory was established to predict growth kinetics of the intermetallic compounds (IMCs) formed in roll bonded Al/Cu sheets during annealing process. The model can give good prediction of both IMC layers growth kinetics and element concentration distribution at the interface of roll bonded Cu/Al sheets with different thickness under different annealing conditions with certain roll reduction range. It is revealed that the calculated results of the proposed model are depended on the inter-diffusion coefficient of each components, which could be related to the interface bonding state, i.e., bonding methods or rolling reductions for roll bonding. And there was big difference in inter-diffusion coefficient of Al and Cu matrix under different bonding state, while the inter-diffusion coefficient of IMCs changed slightly. Graphic |
DOI | 10.1007/s12540-019-00333-z |
WOS ID | WOS:000517098900007 |
Citation statistics | |
Document Type | 期刊论文 |
Identifier | http://ir.imr.ac.cn/handle/321006/83089 |
Collection | 中国科学院金属研究所 |
Recommended Citation GB/T 7714 | Hua, Fu-an,Song, Hong-wu,Sun, Tao,et al. Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process[J]. METALS AND MATERIALS INTERNATIONAL,2020,26(3):333-345. |
APA | Hua, Fu-an,Song, Hong-wu,Sun, Tao,&Li, Jian-ping.(2020).Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process.METALS AND MATERIALS INTERNATIONAL,26(3),333-345. |
MLA | Hua, Fu-an,et al."Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process".METALS AND MATERIALS INTERNATIONAL 26.3(2020):333-345. |
Files in This Item: | There are no files associated with this item. |
Items in the repository are protected by copyright, with all rights reserved, unless otherwise indicated.
Edit Comment