Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process

doi:10.1007/s12540-019-00333-z

IMR OpenIR

	Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process
	Hua, Fu-an; Song, Hong-wu; Sun, Tao; Li, Jian-ping
	2020-03-01
Source Publication	METALS AND MATERIALS INTERNATIONAL
Volume	26 Issue:3 Pages:333-345
Abstract	A model based on inter-diffusion theory was established to predict growth kinetics of the intermetallic compounds (IMCs) formed in roll bonded Al/Cu sheets during annealing process. The model can give good prediction of both IMC layers growth kinetics and element concentration distribution at the interface of roll bonded Cu/Al sheets with different thickness under different annealing conditions with certain roll reduction range. It is revealed that the calculated results of the proposed model are depended on the inter-diffusion coefficient of each components, which could be related to the interface bonding state, i.e., bonding methods or rolling reductions for roll bonding. And there was big difference in inter-diffusion coefficient of Al and Cu matrix under different bonding state, while the inter-diffusion coefficient of IMCs changed slightly. Graphic
DOI	10.1007/s12540-019-00333-z
WOS ID	WOS:000517098900007
Citation statistics	Cited Times:1[WOS] [WOS Record] [Related Records in WOS]
Document Type	期刊论文
Identifier	http://ir.imr.ac.cn/handle/321006/83089
Collection	中国科学院金属研究所
Recommended Citation GB/T 7714	Hua, Fu-an,Song, Hong-wu,Sun, Tao,et al. Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process[J]. METALS AND MATERIALS INTERNATIONAL,2020,26(3):333-345.
APA	Hua, Fu-an,Song, Hong-wu,Sun, Tao,&Li, Jian-ping.(2020).Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process.METALS AND MATERIALS INTERNATIONAL,26(3),333-345.
MLA	Hua, Fu-an,et al."Inter-diffusion Based Analytical Model for Growth Kinetics of IMC Layers at Roll Bonded Cu/Al Interface During Annealing Process".METALS AND MATERIALS INTERNATIONAL 26.3(2020):333-345.

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