Evolution and Growth Mechanism of Cu-2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging

doi:10.1007/s11664-019-07909-w

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	Evolution and Growth Mechanism of Cu-2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging
	Tian, Feifei; Pang, Xueyong; Xu, Bo; Liu, Zhi-Quan
	2020-04-01
Source Publication	JOURNAL OF ELECTRONIC MATERIALS
Volume	49 Issue:4 Pages:2651-2659
Abstract	Evolution of Cu-2(In,Sn) formed between In-48Sn solder and polycrystalline Cu during long-time liquid-state aging was systematically investigated. During aging at 160 degrees C up to 90 min, one IMC species, Cu-2(In,Sn) was found, which showed two different morphologies, a coarse-grained Cu-2(In,Sn) sublayer and a fine-grained Cu2(In,Sn) sublayer. The fine Cu-2(In,Sn) grains had and always kept a granular morphology without any growth orientation. The morphology of coarse Cu-2(In,Sn) grains evolved from poly-facet pyramidal-type without preferential orientation into hexagonal structure preferring only one elongated direction after aging up to 90 min. Electron beam backscattered diffraction revealed that coarse-grain Cu-2(In,Sn) compound grew along [0001] axis and exposed {11-20} crystal planes. Growth mechanism of coarse Cu-2(In,Sn) grains related closely to thermodynamic stability of hexagonal structure, which drove by reduction of surface energy from higher to lower, and first principles calculations verified that {11-20} crystal planes had the lowest surface energy. Fine Cu-2(In,Sn) grains had a special growth mechanism at the root of coarse Cu-2(In,Sn) grains compared to normal fine Cu-2(In,Sn) grains underneath coarse Cu-2(In,Sn) grains.
DOI	10.1007/s11664-019-07909-w
WOS ID	WOS:000505344800016
Citation statistics
Document Type	期刊论文
Identifier	http://ir.imr.ac.cn/handle/321006/83248
Collection	中国科学院金属研究所
Recommended Citation GB/T 7714	Tian, Feifei,Pang, Xueyong,Xu, Bo,et al. Evolution and Growth Mechanism of Cu-2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging[J]. JOURNAL OF ELECTRONIC MATERIALS,2020,49(4):2651-2659.
APA	Tian, Feifei,Pang, Xueyong,Xu, Bo,&Liu, Zhi-Quan.(2020).Evolution and Growth Mechanism of Cu-2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging.JOURNAL OF ELECTRONIC MATERIALS,49(4),2651-2659.
MLA	Tian, Feifei,et al."Evolution and Growth Mechanism of Cu-2(In,Sn) Formed Between In-48Sn Solder and Polycrystalline Cu During Long-Time Liquid-State Aging".JOURNAL OF ELECTRONIC MATERIALS 49.4(2020):2651-2659.

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