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Deformation induced grain boundary segregation in nanolaminated Al-Cu alloy
Xu, W.; Liu, X. C.; Li, X. Y.; Lu, K.
2020
Source PublicationACTA MATERIALIA
Volume182Pages:207-214
AbstractA gradient nanostructured surface layer was formed in an Al-4 wt%Cu alloy processed by means of surface mechanical grinding treatment at liquid nitrogen temperature. Within the deformed surface layer, laminated structures with a wide range of thickness were formed. With a decreasing depth from the treated surface, lamellae thickness decreases accompanied by an increased fraction of high angle grain boundaries (HAGBs) from 10% to 70%. In the topmost surface layer, nanolaminated (NL) structures were found with an average thickness as small as 28 nm and a HAGB fraction of 70%. Composition analysis indicated that Cu atoms segregate at NL boundaries in the as-prepared sample, Cu concentration is about 3-4 times higher than that in the lattice. The obvious grain boundary (GB) segregation of Cu induced by cryogenic plastic deformation is attributed dynamic interaction between solute atoms with gliding dislocations. GB segregation of Cu is responsible for the stabilization of the NL structures with a much finer structural size than that in pure Al, resulting in higher hardness. The deformation-induced GB segregation provides an alternative strategy to achieving stable high strength nanostructures in Al alloys. (C) 2019 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
DOI10.1016/j.actamat.2019.10.036
WOS IDWOS:000501655200020
Citation statistics
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/83264
Collection中国科学院金属研究所
Recommended Citation
GB/T 7714
Xu, W.,Liu, X. C.,Li, X. Y.,et al. Deformation induced grain boundary segregation in nanolaminated Al-Cu alloy[J]. ACTA MATERIALIA,2020,182:207-214.
APA Xu, W.,Liu, X. C.,Li, X. Y.,&Lu, K..(2020).Deformation induced grain boundary segregation in nanolaminated Al-Cu alloy.ACTA MATERIALIA,182,207-214.
MLA Xu, W.,et al."Deformation induced grain boundary segregation in nanolaminated Al-Cu alloy".ACTA MATERIALIA 182(2020):207-214.
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