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Microstructure evolution in a rapidly solidified Cu85Fe15 alloy undercooled into the metastable miscibility gap
He, J; Zhao, JZ
通讯作者Zhao, JZ()
2005-09-01
发表期刊JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY
ISSN1005-0302
卷号21期号:5页码:759-762
摘要A model has been developed to describe the microstructure evolution in the atomized droplets of Cu-Fe alloy during cooling through the metastable miscibility gap. Calculations have been performed for CU85Fe15 alloy to investigate the process of liquid-liquid phase transformation. The numerical results indicate that the minority phase droplets are nucleated in a temperature region around the peak of the supersaturation. The average radius of the Fe-rich droplets decreases and the number density of the minority phase droplets increases with decreasing the atomized droplet size. The simulated results were compared with the experimental ones. The kinetic process of the liquid-liquid phase transformation was discussed in detail.
关键词Cu-Fe alloy metastable miscibility gap liquid-liquid phase transformation microstructure evolution modeling
收录类别SCI
语种英语
WOS研究方向Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS记录号WOS:000232316600030
出版者JOURNAL MATER SCI TECHNOL
引用统计
被引频次:15[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/83756
专题中国科学院金属研究所
通讯作者Zhao, JZ
作者单位Chinese Acad Sci, Met Res Inst, Shenyang 110016, Peoples R China
推荐引用方式
GB/T 7714
He, J,Zhao, JZ. Microstructure evolution in a rapidly solidified Cu85Fe15 alloy undercooled into the metastable miscibility gap[J]. JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,2005,21(5):759-762.
APA He, J,&Zhao, JZ.(2005).Microstructure evolution in a rapidly solidified Cu85Fe15 alloy undercooled into the metastable miscibility gap.JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY,21(5),759-762.
MLA He, J,et al."Microstructure evolution in a rapidly solidified Cu85Fe15 alloy undercooled into the metastable miscibility gap".JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY 21.5(2005):759-762.
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