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Interfacial reactions in 3D-SiC network reinforced Cu-matrix composites prepared by squeeze casting
Xing, HW; Cao, XM; Hu, WP; Zhao, LZ; Zhang, JS
通讯作者Zhang, JS()
2005-05-01
发表期刊MATERIALS LETTERS
ISSN0167-577X
卷号59期号:12页码:1563-1566
摘要Copper matrix composites reinforced with 3D-silicon carbide network were prepared by squeeze casting process at 1150 degrees C. The interfacial reaction during preparation was studied by means of energy-dispersive X-ray spectroscopy analyzer (XEDS) attached to scanning electron microscope (SEM), X-ray diffractometry (XRD), transmission electron microscope (TEM) and analytical electron microscope (AEM). This study revealed that silicon in the 3D-SiC network reacted with copper producing CU3Si, while SiC itself did not react with copper under the experiment conditions. The shape of present CU3Si Was mainly lathy distribution in the composites and some cracks were found in it. Avoiding remnants silicon of the 3D-SiC network could prevent from the reaction Of CU3Si. (c) 2005 Elsevier B.V. All rights reserved.
关键词metal matrix composite network copper silicon carbide squeeze casting
DOI10.1016/j.matlet.2005.01.023
收录类别SCI
语种英语
WOS研究方向Materials Science ; Physics
WOS类目Materials Science, Multidisciplinary ; Physics, Applied
WOS记录号WOS:000228385500021
出版者ELSEVIER SCIENCE BV
引用统计
被引频次:65[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/83850
专题中国科学院金属研究所
通讯作者Zhang, JS
作者单位Chinese Acad Sci, Met Res Inst, Shenyang 110016, Peoples R China
推荐引用方式
GB/T 7714
Xing, HW,Cao, XM,Hu, WP,et al. Interfacial reactions in 3D-SiC network reinforced Cu-matrix composites prepared by squeeze casting[J]. MATERIALS LETTERS,2005,59(12):1563-1566.
APA Xing, HW,Cao, XM,Hu, WP,Zhao, LZ,&Zhang, JS.(2005).Interfacial reactions in 3D-SiC network reinforced Cu-matrix composites prepared by squeeze casting.MATERIALS LETTERS,59(12),1563-1566.
MLA Xing, HW,et al."Interfacial reactions in 3D-SiC network reinforced Cu-matrix composites prepared by squeeze casting".MATERIALS LETTERS 59.12(2005):1563-1566.
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