| Interfacial reactions in 3D-SiC network reinforced Cu-matrix composites prepared by squeeze casting |
| Xing, HW; Cao, XM; Hu, WP; Zhao, LZ; Zhang, JS
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通讯作者 | Zhang, JS()
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| 2005-05-01
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发表期刊 | MATERIALS LETTERS
 |
ISSN | 0167-577X
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卷号 | 59期号:12页码:1563-1566 |
摘要 | Copper matrix composites reinforced with 3D-silicon carbide network were prepared by squeeze casting process at 1150 degrees C. The interfacial reaction during preparation was studied by means of energy-dispersive X-ray spectroscopy analyzer (XEDS) attached to scanning electron microscope (SEM), X-ray diffractometry (XRD), transmission electron microscope (TEM) and analytical electron microscope (AEM). This study revealed that silicon in the 3D-SiC network reacted with copper producing CU3Si, while SiC itself did not react with copper under the experiment conditions. The shape of present CU3Si Was mainly lathy distribution in the composites and some cracks were found in it. Avoiding remnants silicon of the 3D-SiC network could prevent from the reaction Of CU3Si. (c) 2005 Elsevier B.V. All rights reserved. |
关键词 | metal matrix composite
network
copper
silicon carbide
squeeze casting
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DOI | 10.1016/j.matlet.2005.01.023
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收录类别 | SCI
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语种 | 英语
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WOS研究方向 | Materials Science
; Physics
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WOS类目 | Materials Science, Multidisciplinary
; Physics, Applied
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WOS记录号 | WOS:000228385500021
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出版者 | ELSEVIER SCIENCE BV
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引用统计 |
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文献类型 | 期刊论文
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条目标识符 | http://ir.imr.ac.cn/handle/321006/83850
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专题 | 中国科学院金属研究所
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通讯作者 | Zhang, JS |
作者单位 | Chinese Acad Sci, Met Res Inst, Shenyang 110016, Peoples R China
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推荐引用方式 GB/T 7714 |
Xing, HW,Cao, XM,Hu, WP,et al. Interfacial reactions in 3D-SiC network reinforced Cu-matrix composites prepared by squeeze casting[J]. MATERIALS LETTERS,2005,59(12):1563-1566.
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APA |
Xing, HW,Cao, XM,Hu, WP,Zhao, LZ,&Zhang, JS.(2005).Interfacial reactions in 3D-SiC network reinforced Cu-matrix composites prepared by squeeze casting.MATERIALS LETTERS,59(12),1563-1566.
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MLA |
Xing, HW,et al."Interfacial reactions in 3D-SiC network reinforced Cu-matrix composites prepared by squeeze casting".MATERIALS LETTERS 59.12(2005):1563-1566.
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