Modeling of microstructure evolution during directional solidification process

IMR OpenIR

	Modeling of microstructure evolution during directional solidification process
	Li, Q ; Li, DZ ; Qian, BN
通讯作者	Li, Q(qli@imr.ac.cn)
	2005-06-01
发表期刊	JOURNAL OF WUHAN UNIVERSITY OF TECHNOLOGY-MATERIALS SCIENCE EDITION
ISSN	1000-2413
卷号	20 期号:2 页码:94-98
摘要	A model was presented to describe the microstructure evolution during the solidifcation process. In this model, the problem different properties in the solid and liquid phase was solved by making face. Furthermore, a random noise was incorporated to reflect the properties continuous at the solid/liquid inter the anisotropic growth. Moreover, the averaging solute conservation was developed to keep the total solute conservation in the interface region. A simple ingot was simulated by this method, the model can represent the microstructure evolution, solute concentration redistribution, micro-segregation and the columnar-to-equiaxed transition.
关键词	directional solidification microstructure evolution columar-to-equiped transition micro-segregation
收录类别	SCI
语种	英语
WOS研究方向	Materials Science
WOS类目	Materials Science, Multidisciplinary
WOS记录号	WOS:000233501000027
出版者	JOURNAL WUHAN UNIV TECHNOLOGY
引用统计
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/84441
专题	中国科学院金属研究所
通讯作者	Li, Q
作者单位	1.Shengyang Univ Technol, Sch Mat Sci & Engn, Shenyang 110023, Peoples R China 2.Chinese Acad Sci, Met Res Inst, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Li, Q,Li, DZ,Qian, BN. Modeling of microstructure evolution during directional solidification process[J]. JOURNAL OF WUHAN UNIVERSITY OF TECHNOLOGY-MATERIALS SCIENCE EDITION,2005,20(2):94-98.
APA	Li, Q,Li, DZ,&Qian, BN.(2005).Modeling of microstructure evolution during directional solidification process.JOURNAL OF WUHAN UNIVERSITY OF TECHNOLOGY-MATERIALS SCIENCE EDITION,20(2),94-98.
MLA	Li, Q,et al."Modeling of microstructure evolution during directional solidification process".JOURNAL OF WUHAN UNIVERSITY OF TECHNOLOGY-MATERIALS SCIENCE EDITION 20.2(2005):94-98.