| Investigation of the relationship between annealing temperature and yield strength in Cu film by in-situ XRD stress analysis method |
| Qin, M; Ji, V; Wu, YN; Ma, SY; Li, JB
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通讯作者 | Qin, M(mqin@imr.ac.cn)
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| 2005
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发表期刊 | RESIDUAL STRESSES VII, PROCEEDINGS
 |
ISSN | 0255-5476
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卷号 | 490-491页码:595-600 |
关键词 | Cu film
annealing temperature
yield strength
biaxial stresses
X-ray tensile test
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收录类别 | SCI
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语种 | 英语
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WOS研究方向 | Materials Science
; Metallurgy & Metallurgical Engineering
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WOS类目 | Materials Science, Multidisciplinary
; Metallurgy & Metallurgical Engineering
; Materials Science, Characterization & Testing
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WOS记录号 | WOS:000230305200102
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出版者 | TRANS TECH PUBLICATIONS LTD
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引用统计 |
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文献类型 | 期刊论文
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条目标识符 | http://ir.imr.ac.cn/handle/321006/85294
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专题 | 中国科学院金属研究所
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通讯作者 | Qin, M |
作者单位 | Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, SYNL, Shenyang 110016, Peoples R China
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推荐引用方式 GB/T 7714 |
Qin, M,Ji, V,Wu, YN,et al. Investigation of the relationship between annealing temperature and yield strength in Cu film by in-situ XRD stress analysis method[J]. RESIDUAL STRESSES VII, PROCEEDINGS,2005,490-491:595-600.
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APA |
Qin, M,Ji, V,Wu, YN,Ma, SY,&Li, JB.(2005).Investigation of the relationship between annealing temperature and yield strength in Cu film by in-situ XRD stress analysis method.RESIDUAL STRESSES VII, PROCEEDINGS,490-491,595-600.
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MLA |
Qin, M,et al."Investigation of the relationship between annealing temperature and yield strength in Cu film by in-situ XRD stress analysis method".RESIDUAL STRESSES VII, PROCEEDINGS 490-491(2005):595-600.
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