Microstructures and fatigue damage of submicron thick copper films

IMR OpenIR

	Microstructures and fatigue damage of submicron thick copper films
	Zhang, B ; Sun, KH ; Liu, YD ; Zhang, GP
通讯作者	Zhang, GP()
	2006
发表期刊	ACTA METALLURGICA SINICA
ISSN	0412-1961
卷号	42 期号:1 页码:1-5
摘要	Submicrons thick Cu films were deposited on polyimide substrates with high elasticity and mechanical stability by a magnetron sputtering system. Microstructures of the Cu films were characterized by TEM, electron backscatter imaging of SEM as well as XRD technique. Fatigue damage behaviors of the submicron thick Cu films were investigated under constant load amplitude control. It was found that there exists a large number of micro/nanoscale twins in the annealed films and (111) texture formed in the films. Fatigue extrusions and cracking in the Cu films were suppressed under constant load amplitude control. The fatigue cracks dominantly initiate at the interfaces, where exist strong dislocation interaction at twin boundaries and deformation incompatibility near the interfaces. The enhance of fatigue strength of the submicron thick Cu films results from the constraints of three scales of film thickness, grain size and twin size.
关键词	Cu thin film submicron-scale fatigue microstructure
收录类别	SCI
语种	英语
WOS研究方向	Metallurgy & Metallurgical Engineering
WOS类目	Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000235687800001
出版者	SCIENCE PRESS
引用统计	被引频次：4[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/85540
专题	中国科学院金属研究所
通讯作者	Zhang, GP
作者单位	1.Northeastern Univ, Sch Met & Mat, Shenyang 110004, Peoples R China 2.Chinese Acad Sci, Met Res Inst, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 3.Univ Utah, Dept Elect & Comp Engn, Salt Lake City, UT 84110 USA
推荐引用方式 GB/T 7714	Zhang, B,Sun, KH,Liu, YD,et al. Microstructures and fatigue damage of submicron thick copper films[J]. ACTA METALLURGICA SINICA,2006,42(1):1-5.
APA	Zhang, B,Sun, KH,Liu, YD,&Zhang, GP.(2006).Microstructures and fatigue damage of submicron thick copper films.ACTA METALLURGICA SINICA,42(1),1-5.
MLA	Zhang, B,et al."Microstructures and fatigue damage of submicron thick copper films".ACTA METALLURGICA SINICA 42.1(2006):1-5.