Enhancing adhesion between diamond film and WC-Co substrate

IMR OpenIR

	Enhancing adhesion between diamond film and WC-Co substrate
	Li Jianguo ; Hu Dongping ; Mei Jun ; Liu Shi ; Li Yiyi
通讯作者	Li Jianguo(jiangli@imr.ac.cn)
	2006-07-11
发表期刊	ACTA METALLURGICA SINICA
ISSN	0412-1961
卷号	42 期号:7 页码:763-769
摘要	The effects of Murakami solution and H-2 plasma treatment on the surface morphology and structure of WC-Co alloy have been investigated by using of SEM and XRD. The adhesion of the pretreated WC-Co tools coated with composite diamond film was evaluated with indentation method and drilling test. The results show that the composite diamond film consisted of nanocrystalline and microcrystalline has uniform surface morphologies and low roughness. The Murakami solution treatment induced uniform and fine grooves on the surface of WC-Co tool, as a result, the critical load between diamond film and substrate reached about 1.5 kN, which was examined with indentation method, but this kind of drill does not possess a good cutting performance. H-2 plasma treatment promoted WC grain more coarse and compact, the critical load between diamond film and this treated tool is over 1.5 kN and this kind of drill has excellent cutting performance.
关键词	composite diamond film WC-Co adhesion Murakami solution H-2 plasma
收录类别	SCI
语种	英语
WOS研究方向	Metallurgy & Metallurgical Engineering
WOS类目	Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000239402500016
出版者	SCIENCE CHINA PRESS
引用统计	被引频次：3[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/86312
专题	中国科学院金属研究所
通讯作者	Li Jianguo
作者单位	1.China Acad Engn Phys, Inst Struct Mech, Mianyang 621900, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Li Jianguo,Hu Dongping,Mei Jun,et al. Enhancing adhesion between diamond film and WC-Co substrate[J]. ACTA METALLURGICA SINICA,2006,42(7):763-769.
APA	Li Jianguo,Hu Dongping,Mei Jun,Liu Shi,&Li Yiyi.(2006).Enhancing adhesion between diamond film and WC-Co substrate.ACTA METALLURGICA SINICA,42(7),763-769.
MLA	Li Jianguo,et al."Enhancing adhesion between diamond film and WC-Co substrate".ACTA METALLURGICA SINICA 42.7(2006):763-769.