Dewetting of SnAgCu lead-free solder liquid on non-wetting line

IMR OpenIR

	Dewetting of SnAgCu lead-free solder liquid on non-wetting line
	Wang Fuxue ; Zhang Lei ; Shi Chunyuan ; Shang Jianku
通讯作者	Zhang Lei(lzhang@imr.ac.cn)
	2006-12-01
发表期刊	ACTA METALLURGICA SINICA
ISSN	0412-1961
卷号	42 期号:12 页码:1298-1302
摘要	Specific non-wetting lines with a definite width of 200 mu m were prepared on copper substrates. The dewetting of SnAgCu lead-free liquids on the non-wetting line was observed and recorded in situ during the reflow of the samples. It was found that the shapes of the solder liquids varied with the height of the printed solder paste. As the height decreased from 950 mu m, the separation length of the liquid along the non wetting line was elongated gradually. For the solder paste with a height of 350 mu m, the liquid sphere cap was completely separated by the non-wetting line. The dependence of the critical height of the solder liquid on the width of non-wetting line was proposed based on interfacial energy minimization. The experiment agreed with the critical height for a 200 mu m non-wetting line calculated accordingly. These results gave a clear hint on the origin of solder bridging.
关键词	lead-free solder solder bridge wetting dewetting
收录类别	SCI
语种	英语
WOS研究方向	Metallurgy & Metallurgical Engineering
WOS类目	Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000243417000013
出版者	SCIENCE CHINA PRESS
引用统计	被引频次：3[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/87100
专题	中国科学院金属研究所
通讯作者	Zhang Lei
作者单位	1.Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Met Res Inst, Shenyang 110016, Peoples R China 2.Dalian Jiaotong Univ, Sch Mat Sci & Engn, Dalian 116028, Peoples R China
推荐引用方式 GB/T 7714	Wang Fuxue,Zhang Lei,Shi Chunyuan,et al. Dewetting of SnAgCu lead-free solder liquid on non-wetting line[J]. ACTA METALLURGICA SINICA,2006,42(12):1298-1302.
APA	Wang Fuxue,Zhang Lei,Shi Chunyuan,&Shang Jianku.(2006).Dewetting of SnAgCu lead-free solder liquid on non-wetting line.ACTA METALLURGICA SINICA,42(12),1298-1302.
MLA	Wang Fuxue,et al."Dewetting of SnAgCu lead-free solder liquid on non-wetting line".ACTA METALLURGICA SINICA 42.12(2006):1298-1302.