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Measurement of crystal thickness and orientation from selected-area Fourier transformation of a high-resolution electron hologram
Du, K; Wang, YM; Lichte, H; Ye, HQ
通讯作者Du, K(kxd44@cwru.edu)
2006
发表期刊MICRON
ISSN0968-4328
卷号37期号:1页码:67-72
摘要Precise knowledge of crystal thickness and orientation is critical for reliable interpretation of high-resolution transmission electron micrographs. In this paper, we propose a criterion of S-2(T, u, v), which measures the crystal thickness by intensity matching of the selected-area Fourier transform of experimental holograms with the calculated electron diffraction pattern at a series of trial thicknesses (T) and crystal tilts (it, v). This criterion has been demonstrated successfully for local thickness determination from a simulated high-resolution image of a wedge-shaped YBa2Cu3O7-delta and from an experimental hologram of a Si crystal. (c) 2005 Published by Elsevier Ltd.
关键词electron holography high-resolution transmission electron microscopy quantitative electron microscopy
DOI10.1016/j.micron.2005.05.007
收录类别SCI
语种英语
WOS研究方向Microscopy
WOS类目Microscopy
WOS记录号WOS:000234032700008
出版者PERGAMON-ELSEVIER SCIENCE LTD
引用统计
被引频次:1[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/87701
专题中国科学院金属研究所
通讯作者Du, K
作者单位1.Case Western Reserve Univ, Dept Mat Sci & Engn, Cleveland, OH 44106 USA
2.Chinese Acad Sci, Met Res Inst, Shenyang 110016, Peoples R China
3.Dresden Univ Technol, Inst Appl Phys, D-01062 Dresden, Germany
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GB/T 7714
Du, K,Wang, YM,Lichte, H,et al. Measurement of crystal thickness and orientation from selected-area Fourier transformation of a high-resolution electron hologram[J]. MICRON,2006,37(1):67-72.
APA Du, K,Wang, YM,Lichte, H,&Ye, HQ.(2006).Measurement of crystal thickness and orientation from selected-area Fourier transformation of a high-resolution electron hologram.MICRON,37(1),67-72.
MLA Du, K,et al."Measurement of crystal thickness and orientation from selected-area Fourier transformation of a high-resolution electron hologram".MICRON 37.1(2006):67-72.
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