The development of microstructure in a rapidly solidified Cu

doi:10.1016/j.msea.2006.10.117

IMR OpenIR

	The development of microstructure in a rapidly solidified Cu
	Liu, J.; Zhao, J. Z.; Hu, Z. Q.
通讯作者	Zhao, J. Z.(jzzhao@imr.ac.cn)
	2007-04-15
发表期刊	MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING
ISSN	0921-5093
卷号	452 页码:103-109
摘要	Molecular dynamics simulations have been performed to study the rapid solidification processes of liquid Cu using different cooling rates ranging from 5 x 10(11) to 2 x 10(14) K/s. Based on the embedded-atom method (EAM), the time-temperature transformation (TTT) diagram is constructed. The critical cooling rate determined by the position of the nose of the diagram is suggested to be about 7 x 10(12) K/s. The radial distribution function (RDF) and the pair analysis (PA) results show that cooling the melt using a rate above the critical rate leads to a glass transition in the system. The glass transition temperature (T-g) increases with the increase of the cooling rate and can be well fitted by a Vogel-Fulcher-type function. There are large number of icosahedra and defect icosahedra in the glass system. They interact with each other and form large glass clusters during the cooling of the system. The size of the glass clusters grows rapidly until the liquid-solid transition temperature is reached. If the cooling rate is below the critical rate, crystallization happens. There are both fee and hcp microstructures in the crystal Cu. The size of the critical nucleus is about 300 atoms, corresponding to a radius of about 10.4 angstrom when the cooling rate is 5 x 10(11) K/s. A higher cooling rate causes a smaller critical size and a faster growth rate of the nucleus. (c) 2006 Elsevier B.V. All rights reserved.
关键词	molecular dynamics simulation atomic cluster glass transition crystallization
DOI	10.1016/j.msea.2006.10.117
收录类别	SCI
语种	英语
WOS研究方向	Science & Technology - Other Topics ; Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目	Nanoscience & Nanotechnology ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000245639800015
出版者	ELSEVIER SCIENCE SA
引用统计	被引频次：22[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/89850
专题	中国科学院金属研究所
通讯作者	Zhao, J. Z.
作者单位	Chinese Acad Sci, Met Res Inst, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Liu, J.,Zhao, J. Z.,Hu, Z. Q.. The development of microstructure in a rapidly solidified Cu[J]. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2007,452:103-109.
APA	Liu, J.,Zhao, J. Z.,&Hu, Z. Q..(2007).The development of microstructure in a rapidly solidified Cu.MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,452,103-109.
MLA	Liu, J.,et al."The development of microstructure in a rapidly solidified Cu".MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING 452(2007):103-109.