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Stresses and microstructural development of thermal barrier coatings using AIP/D-gun two-step processing
Ke, Peiling; Wang, Qimin; Hua, Weigang; Gong, Jun; Sun, Chao; Zhou, Yanchun
Corresponding AuthorSun, Chao(csun@imr.ac.cn)
2007-03-01
Source PublicationJOURNAL OF THE AMERICAN CERAMIC SOCIETY
ISSN0002-7820
Volume90Issue:3Pages:936-941
AbstractAfter depositing a Ni-32Co-20Cr-8Al-0.5Y-1Si-0.03B (wt%) bond coat on a Ni-base superalloy using arc ion plating (AIP), a ceramic top coat with hollow spherical powder of ZrO2-8 wt%Y2O3 (HSP-YSZ) was deposited using detonation gun (D-gun) spraying. Thermal exposure behaviors of thermal barrier coatings (TBCs) were investigated at 1100 degrees C. The thermal growth oxides (TGO) layer thickened and became more undulated during thermal exposure. Yttrium aluminum garnet (YAG) was observed within TGO, which produced thickness imperfections and thus aided to build up out-of-plane stresses. As a result, radial cracks initiated at the defects around TGO imperfections and separation developed through crack nucleation, propagation, and coalescence at the weaker TGO/bond coat interface. With further thermal exposure, coalescence of interfacial separations created a connected crack. The TBC detached and final failure occurred at the TGO/bond coat interface, leading to spallation of TBC when cooling to ambient. The stress distributions in the TGO layer with different thermal exposure times were also measured using luminescence spectroscopy. The stresses were independent of time after a transient period from theta-Al2O3 to alpha-Al2O3 scale. It is suggested that the lifetime of AIP/D-gun TBCs with an HSP-YSZ coat is controlled by the initiation and linking of a sub-critical interfacial crack.
DOI10.1111/j.1551-2916.2007.01496.x
Indexed BySCI
Language英语
WOS Research AreaMaterials Science
WOS SubjectMaterials Science, Ceramics
WOS IDWOS:000244720100041
PublisherBLACKWELL PUBLISHING
Citation statistics
Cited Times:7[WOS]   [WOS Record]     [Related Records in WOS]
Document Type期刊论文
Identifierhttp://ir.imr.ac.cn/handle/321006/92444
Collection中国科学院金属研究所
Corresponding AuthorSun, Chao
AffiliationChinese Acad Sci, Met Res Inst, Shenyang 110016, Peoples R China
Recommended Citation
GB/T 7714
Ke, Peiling,Wang, Qimin,Hua, Weigang,et al. Stresses and microstructural development of thermal barrier coatings using AIP/D-gun two-step processing[J]. JOURNAL OF THE AMERICAN CERAMIC SOCIETY,2007,90(3):936-941.
APA Ke, Peiling,Wang, Qimin,Hua, Weigang,Gong, Jun,Sun, Chao,&Zhou, Yanchun.(2007).Stresses and microstructural development of thermal barrier coatings using AIP/D-gun two-step processing.JOURNAL OF THE AMERICAN CERAMIC SOCIETY,90(3),936-941.
MLA Ke, Peiling,et al."Stresses and microstructural development of thermal barrier coatings using AIP/D-gun two-step processing".JOURNAL OF THE AMERICAN CERAMIC SOCIETY 90.3(2007):936-941.
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