Effect of intermetallics Ag3Sn on the tensile property of Sn3.8Ag0.7Cu solder alloy

IMR OpenIR

	Effect of intermetallics Ag3Sn on the tensile property of Sn3.8Ag0.7Cu solder alloy
	Zhu Qingsheng ; Zhang Li ; Wang Zhongguang ; Wu Shiding ; Shang Jianku
通讯作者	Wang Zhongguang(zhgwang@imx.ac.cn)
	2007
发表期刊	ACTA METALLURGICA SINICA
ISSN	0412-1961
卷号	43 期号:1 页码:41-46
摘要	Sn3.8Ag0.7Cu alloys containing Ag3Sn intermetallic compound (IMC) with different morphologies, sizes and distributions were prepared by controlling cooling rate during solidification and equal channel angle pressing process (ECAP). The relation between mechanical property of the alloys and IMC phase was investigated. The tensile stress-strain curves of the alloys with different, i-nicrostructures were compared and the deformed microstructures were observed by SEM and TEM. While the large needle-like Ag3Sn was found to provide fiber-strengthening effect to the alloy, its brittle fracture promoted void nucleation, resulting in a deterioration of tensile elongation. The fine particles of Ag3Sn produced by ECAP enhanced dispersion strengthening by blocking the dislocation motion. The particles on the boundaries of fine equiaxed Sn grains inhibited the boundary sliding, leading to improvement of the tensile strength.
关键词	Pb-free solder Sn3.8Ag0.7Cu alloy intermetallics equal channel angular pressing mechanical property
收录类别	SCI
语种	英语
WOS研究方向	Metallurgy & Metallurgical Engineering
WOS类目	Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000244315000008
出版者	SCIENCE CHINA PRESS
引用统计	被引频次：10[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/92451
专题	中国科学院金属研究所
通讯作者	Wang Zhongguang
作者单位	1.Chinese Acad Sci, Met Res Inst, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China 2.Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA
推荐引用方式 GB/T 7714	Zhu Qingsheng,Zhang Li,Wang Zhongguang,et al. Effect of intermetallics Ag3Sn on the tensile property of Sn3.8Ag0.7Cu solder alloy[J]. ACTA METALLURGICA SINICA,2007,43(1):41-46.
APA	Zhu Qingsheng,Zhang Li,Wang Zhongguang,Wu Shiding,&Shang Jianku.(2007).Effect of intermetallics Ag3Sn on the tensile property of Sn3.8Ag0.7Cu solder alloy.ACTA METALLURGICA SINICA,43(1),41-46.
MLA	Zhu Qingsheng,et al."Effect of intermetallics Ag3Sn on the tensile property of Sn3.8Ag0.7Cu solder alloy".ACTA METALLURGICA SINICA 43.1(2007):41-46.