MODELING OF Ag3Sn COARSENING AND ITS EFFECT ON CREEP IN Sn-Ag-Cu SOLDER

IMR OpenIR

	MODELING OF Ag3Sn COARSENING AND ITS EFFECT ON CREEP IN Sn-Ag-Cu SOLDER
	Wang Xiaojing 1; Zhu Qingsheng 1; Wang Zhongguang 1; Shang Jianku 1,2
通讯作者	Wang Zhongguang(zhgwang@imr.ac.cn)
	2009-08-11
发表期刊	ACTA METALLURGICA SINICA
ISSN	0412-1961
卷号	45 期号:8 页码:912-918
摘要	Coarsening of the microstructure in Sn-Ag-Cu (SAC) solder joints under current stressing was observed experimentally and modeled by a dislocation-creep model which incorporates the coarsening of second phase particles in lead-free solder alloys. Both the effects of electric current and strain-enhanced coarsening were considered in this model. The straining effect took into account of both the inelastic-strain history and hydrostatic constraint. The model describes well the evolution of the eutectic microstructure and the predictions of the model agree reasonably well with experimentally observed trends.
关键词	Pb-free solder particle coarsening electric current
资助者	National Basic Research Program of China
收录类别	SCI
语种	英语
资助项目	National Basic Research Program of China[2004CB619306]
WOS研究方向	Metallurgy & Metallurgical Engineering
WOS类目	Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000269601400003
出版者	SCIENCE PRESS
引用统计	被引频次：5[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/96203
专题	中国科学院金属研究所
通讯作者	Wang Zhongguang
作者单位	1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China 2.Univ Illinois, Dept Mat Sci & Engn, Urbana, IL 61801 USA
推荐引用方式 GB/T 7714	Wang Xiaojing,Zhu Qingsheng,Wang Zhongguang,et al. MODELING OF Ag3Sn COARSENING AND ITS EFFECT ON CREEP IN Sn-Ag-Cu SOLDER[J]. ACTA METALLURGICA SINICA,2009,45(8):912-918.
APA	Wang Xiaojing,Zhu Qingsheng,Wang Zhongguang,&Shang Jianku.(2009).MODELING OF Ag3Sn COARSENING AND ITS EFFECT ON CREEP IN Sn-Ag-Cu SOLDER.ACTA METALLURGICA SINICA,45(8),912-918.
MLA	Wang Xiaojing,et al."MODELING OF Ag3Sn COARSENING AND ITS EFFECT ON CREEP IN Sn-Ag-Cu SOLDER".ACTA METALLURGICA SINICA 45.8(2009):912-918.