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An ordered structure of Cu3Sn in Cu-Sn alloy investigated by transmission electron microscopy
Sang, Mahan1,2; Du, Kui1; Ye, Hengqiang1
通讯作者Du, Kui(kuidu@imr.ac.cn)
2009-02-05
发表期刊JOURNAL OF ALLOYS AND COMPOUNDS
ISSN0925-8388
卷号469期号:1-2页码:129-136
摘要Cu3Sn phase with the D0(19) structure is observed in Cu-Sn alloy by transmission electron microscopy, The structure is determined by electron diffraction, high-resolution transmission electron microscopy and high-angle annular dark-field imaging techniques. To the best of our knowledge this structure has not been reported before in Cu3Sn compounds. Transmission electron microscopy revealed high-density antiphase boundaries lying on the (0 (1) over bar 10) planes with translation vectors of (a/2)((2) over bar 110) in the D0(19) Cu3Sn. (C) 2008 Elsevier B.V. All rights reserved
关键词Intermetallics Crystal structure Cu3Sn Transmission electron microscopy
资助者Natural Sciences Foundation of China
DOI10.1016/j.jallcom.2008.01.107
收录类别SCI
语种英语
资助项目Natural Sciences Foundation of China[50671109] ; Natural Sciences Foundation of China[50601027]
WOS研究方向Chemistry ; Materials Science ; Metallurgy & Metallurgical Engineering
WOS类目Chemistry, Physical ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering
WOS记录号WOS:000263801500024
出版者ELSEVIER SCIENCE SA
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被引频次:37[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/97017
专题中国科学院金属研究所
通讯作者Du, Kui
作者单位1.Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
2.Chinese Acad Sci, Grad Sch, Beijing 100049, Peoples R China
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Sang, Mahan,Du, Kui,Ye, Hengqiang. An ordered structure of Cu3Sn in Cu-Sn alloy investigated by transmission electron microscopy[J]. JOURNAL OF ALLOYS AND COMPOUNDS,2009,469(1-2):129-136.
APA Sang, Mahan,Du, Kui,&Ye, Hengqiang.(2009).An ordered structure of Cu3Sn in Cu-Sn alloy investigated by transmission electron microscopy.JOURNAL OF ALLOYS AND COMPOUNDS,469(1-2),129-136.
MLA Sang, Mahan,et al."An ordered structure of Cu3Sn in Cu-Sn alloy investigated by transmission electron microscopy".JOURNAL OF ALLOYS AND COMPOUNDS 469.1-2(2009):129-136.
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