Direct diffusion bonding of Ti3SiC2 and Ti3AlC2

doi:10.1016/j.materresbull.2008.12.002

IMR OpenIR

	Direct diffusion bonding of Ti3SiC2 and Ti3AlC2
	Yin, Xiaohui 2; Li, Meishuan 1; Xu, Jingjun 1; Zhang, Jie 1; Zhou, Yanchun 1
通讯作者	Li, Meishuan(mshli@imr.ac.cn)
	2009-06-03
发表期刊	MATERIALS RESEARCH BULLETIN
ISSN	0025-5408
卷号	44 期号:6 页码:1379-1384
摘要	Two typical layered ternary compounds. Ti3SiC2 and Ti3AlC2, were joined directly by solid-state diffusion bonding method. By various bonding tests at 1100-1300 degrees C for 30-120 min under 10-30 MPa, and characterizing the microstructure and diffusion reactive phases of the joints by scanning electron microscopy (SEM). energy dispersive X-ray spectrometer (EDS), transmission electron microscopy (TEM) and X-ray diffraction (XRD). the optimal condition for direct joining of Ti3SiC2 and Ti3AlC2 was obtained. Strong joints of Ti3SiC2/Ti3AlC2 can be achieved via diffusion bonding, which is attributed to remarkable interdiffusion of Si and Al at the joint interface. The shear strength of the Ti3SiC2/Ti3AlC2 joints was determined. (C) 2008 Elsevier Ltd. All rights reserved.
关键词	Carbids Layered compounds Diffusion Microstructure
资助者	National Science Foundation of China
DOI	10.1016/j.materresbull.2008.12.002
收录类别	SCI
语种	英语
资助项目	National Science Foundation of China[50771099]
WOS研究方向	Materials Science
WOS类目	Materials Science, Multidisciplinary
WOS记录号	WOS:000265906600032
出版者	PERGAMON-ELSEVIER SCIENCE LTD
引用统计	被引频次：32[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/97072
专题	中国科学院金属研究所
通讯作者	Li, Meishuan
作者单位	1.Chinese Acad Sci, Shenyang Natl Lab Mat Sci, Inst Met Res, Shenyang 110016, Liaoning Prov, Peoples R China 2.Anhui Univ Technol, Sch Mat Sci & Engn, Maanshan 243002, Anhui, Peoples R China
推荐引用方式 GB/T 7714	Yin, Xiaohui,Li, Meishuan,Xu, Jingjun,et al. Direct diffusion bonding of Ti3SiC2 and Ti3AlC2[J]. MATERIALS RESEARCH BULLETIN,2009,44(6):1379-1384.
APA	Yin, Xiaohui,Li, Meishuan,Xu, Jingjun,Zhang, Jie,&Zhou, Yanchun.(2009).Direct diffusion bonding of Ti3SiC2 and Ti3AlC2.MATERIALS RESEARCH BULLETIN,44(6),1379-1384.
MLA	Yin, Xiaohui,et al."Direct diffusion bonding of Ti3SiC2 and Ti3AlC2".MATERIALS RESEARCH BULLETIN 44.6(2009):1379-1384.