HOT DEFORMATION BEHAVIOR OF GH761 WROUGHT Ni BASE SUPERALLOY

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	HOT DEFORMATION BEHAVIOR OF GH761 WROUGHT Ni BASE SUPERALLOY
	Zhao Meilan; Sun Wenru; Yang Shulin; Qi Feng; Guo Shouren; Hu Zhuangqi
通讯作者	Zhao Meilan(mlzhao@imr.ac.cn)
	2009
发表期刊	ACTA METALLURGICA SINICA
ISSN	0412-1961
卷号	45 期号:1 页码:79-83
摘要	The flow stress-strain behavior of GH761 alloy was investigated via hot compression testing. The peak stress sigma(p), starting steady-state stress sigma s, and corresponding strain epsilon(p), epsilon(s) decrease with decreasing strain rate (epsilon) over dot constant temperature. At constant strain rate, sigma(p), sigma(s), and epsilon(s) drop with rising temperature, but epsilon(p) does not change obviously. On the basis of reducing original grain size, lowering deformed temperature and enhancing strain rate can well refine structure. The microstructure will be most homogenous and finest when the strain reaches the level that DRX is finished exactly. Further increasing the strain will promote the grain growth. The hot deformation constitutive equation obtained is as follows: (epsilon) over dot = 6.5 x 10(6)sigma(4.86)(p)exp(-461 X 10(3)/RT).
关键词	GH761 wrought superalloy hot deformation microstructure evolution dynamic recrystallization
收录类别	SCI
语种	英语
WOS研究方向	Metallurgy & Metallurgical Engineering
WOS类目	Metallurgy & Metallurgical Engineering
WOS记录号	WOS:000263767800013
出版者	SCIENCE PRESS
引用统计	被引频次：13[WOS] [WOS记录] [WOS相关记录]
文献类型	期刊论文
条目标识符	http://ir.imr.ac.cn/handle/321006/98115
专题	中国科学院金属研究所
通讯作者	Zhao Meilan
作者单位	Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China
推荐引用方式 GB/T 7714	Zhao Meilan,Sun Wenru,Yang Shulin,et al. HOT DEFORMATION BEHAVIOR OF GH761 WROUGHT Ni BASE SUPERALLOY[J]. ACTA METALLURGICA SINICA,2009,45(1):79-83.
APA	Zhao Meilan,Sun Wenru,Yang Shulin,Qi Feng,Guo Shouren,&Hu Zhuangqi.(2009).HOT DEFORMATION BEHAVIOR OF GH761 WROUGHT Ni BASE SUPERALLOY.ACTA METALLURGICA SINICA,45(1),79-83.
MLA	Zhao Meilan,et al."HOT DEFORMATION BEHAVIOR OF GH761 WROUGHT Ni BASE SUPERALLOY".ACTA METALLURGICA SINICA 45.1(2009):79-83.