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A study on the orientation relationship between the scallop-type Cu6Sn5 grains and (011) Cu substrate using electron backscattered diffraction
Zou, H. F.; Yang, H. J.; Zhang, Z. F.
通讯作者Zou, H. F.(hfzou@imr.ac.cn)
2009-12-01
发表期刊JOURNAL OF APPLIED PHYSICS
ISSN0021-8979
卷号106期号:11页码:3
摘要The wetting reaction between molten Sn and (011) Cu single crystal was investigated. Based on the electron backscattered diffraction technique, the preferential orientation relationships between the scallop-type Cu6Sn5 grains and (011) Cu single crystals were detected. The strong texture of Cu6Sn5 grains was formed on the normal direction although the Sn/(011) Cu couple was aged at 170 degrees C for 40 days. This indicates that the Cu6Sn5 grains do not desultorily form on the (011) Cu substrate for these scallop-type Cu6Sn5 grains.
关键词ageing copper copper alloys electron backscattering electron diffraction texture tin alloys wetting
资助者National Basic Research Program of China ; National Outstanding Young Scientist Foundation
DOI10.1063/1.3266144
收录类别SCI
语种英语
资助项目National Basic Research Program of China[2004CB619306] ; National Basic Research Program of China[2010CB631006] ; National Outstanding Young Scientist Foundation[50625103]
WOS研究方向Physics
WOS类目Physics, Applied
WOS记录号WOS:000272838600030
出版者AMER INST PHYSICS
引用统计
被引频次:25[WOS]   [WOS记录]     [WOS相关记录]
文献类型期刊论文
条目标识符http://ir.imr.ac.cn/handle/321006/99426
专题中国科学院金属研究所
通讯作者Zou, H. F.
作者单位Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
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Zou, H. F.,Yang, H. J.,Zhang, Z. F.. A study on the orientation relationship between the scallop-type Cu6Sn5 grains and (011) Cu substrate using electron backscattered diffraction[J]. JOURNAL OF APPLIED PHYSICS,2009,106(11):3.
APA Zou, H. F.,Yang, H. J.,&Zhang, Z. F..(2009).A study on the orientation relationship between the scallop-type Cu6Sn5 grains and (011) Cu substrate using electron backscattered diffraction.JOURNAL OF APPLIED PHYSICS,106(11),3.
MLA Zou, H. F.,et al."A study on the orientation relationship between the scallop-type Cu6Sn5 grains and (011) Cu substrate using electron backscattered diffraction".JOURNAL OF APPLIED PHYSICS 106.11(2009):3.
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