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Effect of leveler on performance and reliability of copper pillar bumps in wafer electroplating under large current density 期刊论文
MICROELECTRONICS RELIABILITY, 2023, 卷号: 146, 页码: 8
作者:  Zhu, Qing-Sheng;  Ding, Zi-Feng;  Wei, Xiang-Fu;  Guo, Jing-dong;  Wang, Xiao-Jing
收藏  |  浏览/下载：8/0  |  提交时间：2024/01/07
Copper pillar bump  Cu electroplating  Leveler  Interfacial voids  Chip packaging  
The interfacial reaction and microstructure of Co/In/Cu sputtering target assembly after soldering 期刊论文
MICROELECTRONICS RELIABILITY, 2020, 卷号: 113, 页码: 6
作者:  Liu, Zhi-Quan;  Meng, Zhi-Chao;  Wu, Di;  Shang, Zhengang;  He, Xin;  Xiong, Xiaodong
收藏  |  浏览/下载：172/0  |  提交时间：2021/02/02
Co sputtering target  Soldering assembly  Interface  IMC  Growth mechanism  
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：136/0  |  提交时间：2021/02/02
62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling  
Microstructural evolution and failure mechanism of 62Sn36Pb2Ag/Cu solder joint during thermal cycling 期刊论文
MICROELECTRONICS RELIABILITY, 2019, 卷号: 99, 页码: 12-18
作者:  Li, Qi-hai;  Li, Cai-Fu;  Zhang, Wei;  Chen, Wei-wei;  Liu, Zhi-Qua
收藏  |  浏览/下载：128/0  |  提交时间：2021/02/02
62Sn36Pb2Ag solder joint  Microstructural evolution  Failure analysis  Intermetallic compound (IMC)  Thermal cycling  
Corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder joints 期刊论文
MICROELECTRONICS RELIABILITY, 2017, 卷号: 73, 页码: 69-75
作者:  Wang, Mingna;  Wang, Jianqiu;  Ke, Wei;  Wang, MN (reprint author), Hebei Normal Univ Sci & Technol, Dept Phys, 360 West Hebei St, Qinhuangdao 066004, Peoples R China.
收藏  |  浏览/下载：129/0  |  提交时间：2017/08/17
Lead-free Solder Joint  Corrosion  Microstructure  Solidification Cracks  
Ex situ observations of fast intermetallic growth on the surface of interfacial region between eutectic SnBi solder and Cu substrate during solid-state aging process 期刊论文
Microelectronics Reliability, 2013, 卷号: 53, 期号: 6, 页码: 899-905
作者:  P. J. Shang;  L. Zhang;  Z. Q. Liu;  J. Tan;  J. K. Shang
收藏  |  浏览/下载：100/0  |  提交时间：2013/12/24
Mechanical-properties  Joints  Copper  Morphology  Tin  
Effects of Bi segregation on the tensile properties of Cu/Cu3Sn(100) interface 期刊论文
MICROELECTRONICS RELIABILITY, 2011, 卷号: 51, 期号: 12, 页码: 2330-2335
作者:  Pang, X. Y.;  Liu, Z. Q.;  Wang, S. Q.;  Shang, J. K.
收藏  |  浏览/下载：102/0  |  提交时间：2021/02/02
Effects of Bi segregation on the tensile properties of Cu/Cu(3)Sn(100) interface 期刊论文
Microelectronics Reliability, 2011, 卷号: 51, 期号: 12, 页码: 2330-2335
作者:  X. Y. Pang;  Z. Q. Liu;  S. Q. Wang;  J. K. Shang
收藏  |  浏览/下载：100/0  |  提交时间：2012/04/13
Crack-growth-behavior  Lead-free Solders  Alpha-al2o3(0001)/cu(111)  Interface  Mechanical Strength  Reactive Interface  Molecular-dynamics  Joints  Cu3sn  Cu  1st-principles  
Tin whisker growth on bulk Sn-Pb eutectic doping with Nd 期刊论文
Microelectronics Reliability, 2009, 卷号: 49, 期号: 6, 页码: 667-672
作者:  M. Liu;  A. P. Xian
Adobe PDF(530Kb)  |  收藏  |  浏览/下载：99/0  |  提交时间：2012/04/13
Free Solder Alloys  Surface  Cu  Joints  
Whisker growth on tin finishes of different electrolytes 期刊论文
Microelectronics Reliability, 2008, 卷号: 48, 期号: 1, 页码: 105-110
作者:  B. Jiang;  A. P. Man
Adobe PDF(537Kb)  |  收藏  |  浏览/下载：62/0  |  提交时间：2012/04/13