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Tracing the early oxidation of Ni-based superalloys during hot-compression bonding 期刊论文
VACUUM, 2025, 卷号: 238, 页码: 6
作者:  Ren, Shaofei;  Bai, Xiaolong;  Liu, Sheng;  Xu, Bin;  Sun, Mingyue
收藏  |  浏览/下载：2/0  |  提交时间：2025/04/27
Oxidation  Surface  Diffusion  STM  XPS  
Sparse wavefield reconstruction based on Physics-Informed neural networks 期刊论文
ULTRASONICS, 2025, 卷号: 149, 页码: 12
作者:  Xu, Bin;  Zou, Yun;  Sha, Gaofeng;  Yang, Liang;  Cai, Guixi;  Li, Yang
收藏  |  浏览/下载：2/0  |  提交时间：2025/04/27
Physics-Informed Neural Networks  Wavefield Reconstruction  Laser Ultrasonic  Non-destructive Testing  
Improving mechanical properties of dissimilar TA3/L907A steel clad plates with multiple interlayers via hot-compression bonding 期刊论文
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2025, 卷号: 36, 页码: 111-122
作者:  Xiao, He;  Liu, Weifeng;  Dai, Qianning;  Ren, Shaofei;  Xu, Bin;  Wu, Shengqing;  Liu, Sheng;  Sun, Mingyue
收藏  |  浏览/下载：2/0  |  提交时间：2025/04/27
Ti/steel bonding  Interlayer  Interfacial strength  Intermetallic compounds (IMCs)  Hot-compression bonding(HCB)  
Microstructures and mechanical properties of a 30CrNi2MoV steel/GH4098 joint produced by hot-compression bonding 期刊论文
MATERIALS & DESIGN, 2025, 卷号: 251, 页码: 10
作者:  Wu, Shengqing;  Liu, Sheng;  Wang, Hexin;  Ren, Shaofei;  Xu, Bin;  Zhang, Xiaopeng;  Sun, Mingyue
收藏  |  浏览/下载：2/0  |  提交时间：2025/04/27
Hot-compression bonding  Interfacial oxides  Transition layer  Mechanical properties  
Microstructure evolution and interfacial healing mechanism of heterogeneous interfaces in Ni-Co based superalloys during hot compression bonding 期刊论文
MATERIALS CHARACTERIZATION, 2025, 卷号: 220, 页码: 13
作者:  Ren, Shaofei;  Xiao, He;  Wu, Shengqing;  Zeng, Chenqi;  Bai, Xiaolong;  Liu, Sheng;  Xu, Bin;  Cui, Chuanyong;  Ma, Guangcai;  Sun, Mingyue
收藏  |  浏览/下载：2/0  |  提交时间：2025/04/27
Hot compression bonding  Bonding interface  Continuous dynamic recrystallization  Necklace-like recrystallization  Interface healing  
Hot compression bonding of a 9Cr oxide dispersion strengthened alloy and a 9Cr reduced-activation ferritic/martensitic alloy 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2025, 卷号: 207, 页码: 225-237
作者:  Wang, Jianqiang;  Xu, Bin;  Sun, Mingyue;  Liu, Xiang;  Li, Dianzhong
收藏  |  浏览/下载：2/0  |  提交时间：2025/04/27
Hot compression bonding  Oxide dispersion strengthened alloy  Reduced-activation ferritic/martensitic alloy  Dynamic recrystallization  Interfacial oxides  
Hot compression bonding of a 9Cr oxide dispersion strengthened alloy and a 9Cr reduced-activation ferritic/martensitic alloy 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2025, 卷号: 207, 页码: 225-237
作者:  Wang, Jianqiang;  Xu, Bin;  Sun, Mingyue;  Liu, Xiang;  Li, Dianzhong
收藏  |  浏览/下载：1/0  |  提交时间：2025/04/27
Hot compression bonding  Oxide dispersion strengthened alloy  Reduced-activation ferritic/martensitic alloy  Dynamic recrystallization  Interfacial oxides  
Leveraging physics-informed neural networks for wavefield analysis in laser ultrasonic testing 期刊论文
NONDESTRUCTIVE TESTING AND EVALUATION, 2024, 页码: 23
作者:  Li, Yang;  Xu, Bin;  Zou, Yun;  Sha, Gaofeng;  Cai, Guixi
收藏  |  浏览/下载：1/0  |  提交时间：2025/04/27
Physics-informed neural networks  wavefield reconstruction  wavefield prediction  laser ultrasonic  non-destructive testing  
A novel approach for the removal of oxide film to achieve seamless joining during hot-compression bonding 期刊论文
JOURNAL OF MANUFACTURING PROCESSES, 2024, 卷号: 131, 页码: 2101-2117
作者:  Zhao, Yong;  Xu, Bin;  Goel, Saurav;  Xu, Haojie;  Li, Kuo;  Zlatanovic, Danka Labus;  Sun, Mingyue;  Guo, Jiang;  Kang, Renke;  Li, Dianzhong
收藏  |  浏览/下载：1/0  |  提交时间：2025/04/27
Vacuum  Laser treatment  Oxide film  Hot-compression bonding  Seamless joining  
Prediction and formation mechanism of serrated chips in cutting of SA508-3 steel under enhanced cooling and lubrication environments 期刊论文
TRIBOLOGY INTERNATIONAL, 2024, 卷号: 200, 页码: 17
作者:  Wang, Qinqiang;  Zhao, Yong;  Zhang, Chao;  Xu, Haojie;  Xu, Bin;  Wei, Zhaocheng;  Kang, Chengwei;  Li, Dianzhong;  Guo, Jiang
收藏  |  浏览/下载：2/0  |  提交时间：2025/04/27
SA508-3 steel  Lubrication conditions  Critical cutting condition  Chip morphology  Material removal mechanism